Patents by Inventor Miki Yoshinaga

Miki Yoshinaga has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100083583
    Abstract: One object of the present invention is to provide a cutting tool excellent in strength and wear resistance. The cutting tool has a cutting blade formed using a highly hard diamond polycrystalline body made substantially only of diamond and produced by directly converting a raw material composition including a non-diamond type carbon material into diamond and sintering the diamond at an ultra high pressure and an ultra high temperature without adding a sintering aid or a catalyst, the polycrystalline body having a mixed construction including fine-grained diamond crystals with a maximum grain size of less than or equal to 100 nm and an average grain size of less than or equal to 50 nm and plate-like or particulate coarse-grained diamond crystals with a minimum grain size of greater than or equal to 50 nm and a maximum grain size of less than or equal to 10000 nm.
    Type: Application
    Filed: January 18, 2008
    Publication date: April 8, 2010
    Inventors: Hitoshi Sumiya, Kazushi Obata, Miki Yoshinaga
  • Patent number: 7556456
    Abstract: A mono crystalline diamond cutting tool is provided which can perform ultra precision machining on a crystalline material or a hard and brittle material with good swarf discharge and reduced cutting resistance to improve a precision of a cut surface, and has less wear or microchipping of a cutting edge and thus achieves long life. A tip having a cutting edge ridge in a rounded shape at a front end is provided, and a portion of the cutting edge ridge serving at least as a cutting edge is formed to have constant roundness by intersecting a first conical surface as a rake face with a second conical surface as a flank. The cutting edge ridge is rounded with a radius of less than 100 nm, the first conical surface has a width of 1 to 5 ?m, and a swarf release face substantially perpendicular to a cutting direction is provided in a portion on a side of the first conical surface opposite a line of the cutting edge ridge.
    Type: Grant
    Filed: June 15, 2005
    Date of Patent: July 7, 2009
    Assignee: A.L.M.T. Corp.
    Inventors: Miki Yoshinaga, Kazushi Obata
  • Publication number: 20080253849
    Abstract: A mono crystalline diamond cutting tool is provided which can perform ultra precision machining on a crystalline material or a hard and brittle material with good swarf discharge and reduced cutting resistance to improve a precision of a cut surface, and has less wear or microchipping of a cutting edge and thus achieves long life. A tip having a cutting edge ridge in a rounded shape at a front end is provided, and a portion of the cutting edge ridge serving at least as a cutting edge is formed to have constant roundness by intersecting a first conical surface as a rake face with a second conical surface as a flank. The cutting edge ridge is rounded with a radius of less than 100 nm, the first conical surface has a width of 1 to 5 ?m, and a swarf release face substantially perpendicular to a cutting direction is provided in a portion on a side of the first conical surface opposite a line of the cutting edge ridge.
    Type: Application
    Filed: June 15, 2005
    Publication date: October 16, 2008
    Inventors: Miki Yoshinaga, Kazushi Obata