Patents by Inventor Mikiharu KUCHIKI

Mikiharu KUCHIKI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Workpiece cutting method
    Patent number: 11806805
    Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.
    Type: Grant
    Filed: May 17, 2018
    Date of Patent: November 7, 2023
    Assignees: Kyoritsu Chemical & Co., Ltd., HAMAMATSU PHOTONICS K.K.
    Inventors: Mikiharu Kuchiki, Hidefumi Kinda, Daisuke Kurita, Takeshi Sakamoto, Takafumi Ogiwara, Yuta Kondoh, Naoki Uchiyama
  • WORKPIECE CUTTING METHOD
    Publication number: 20200180075
    Abstract: A object cutting method includes a first step of attaching an expandable sheet to a front surface or a back surface of a object, a second step of irradiating the object with a laser light along a line to cut to form a modified region, and expanding the expandable sheet to divide at least a part of the object into a plurality of chips and to form a gap that exists between the chips and extends to a side surface crossing the front surface and the back surface of the object, a third step of, after the second step, filling the gap with a resin from an outer edge portion including the side surface of the object, a fourth step of, after the third step, curing and shrinking the resin, and a fifth step of, after the fourth step, taking out the chips from the expandable sheet.
    Type: Application
    Filed: May 17, 2018
    Publication date: June 11, 2020
    Applicants: Kyoritsu Chemical & Co., Ltd., HAMAMATSU PHOTONICS K.K.
    Inventors: Mikiharu KUCHIKI, Hidefumi KINDA, Daisuke KURITA, Takeshi SAKAMOTO, Takafumi OGIWARA, Yuta KONDOH, Naoki UCHIYAMA
  • IMPRINT TEMPLATE AND METHOD FOR PRODUCING THE SAME
    Publication number: 20170203471
    Abstract: An imprint template is used for photocuring imprinting, and includes a support plate that is transparent with respect to an exposure wavelength used for photocuring imprinting, and has flexibility; a buffer resin layer that is formed on the support plate, and is formed of an elastic material that is transparent with respect to the exposure wavelength; and a resin film mold that is removably bonded to the buffer resin layer, and is transparent with respect to the exposure wavelength, wherein a concave-convex transfer pattern is formed on a surface of the resin film mold.
    Type: Application
    Filed: March 31, 2017
    Publication date: July 20, 2017
    Inventors: Tsutomu OBATA, Yoshiyuki YOKOYAMA, Masaaki NASUNO, Mikiharu KUCHIKI, Tomoshi AONO, Motofumi KASHIWAGI