Patents by Inventor Mikihiro Kajita

Mikihiro Kajita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5459081
    Abstract: In a device fabrication method, there are prepared a first substrate having registration patterns formed thereon and a second substrate having through bores formed therein and devices formed thereon through a separation layer. The two substrates are overlapped by viewing the registration patterns through the through bores. After the first substrate and the devices formed on the second substrate have been bonded, the devices are separated from the second substrate by selectively etching the separation layer, and are transferred to the first substrate.
    Type: Grant
    Filed: December 16, 1994
    Date of Patent: October 17, 1995
    Assignee: NEC Corporation
    Inventor: Mikihiro Kajita