Patents by Inventor Mikihiro Taketomo

Mikihiro Taketomo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9748707
    Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: August 29, 2017
    Assignee: SONY CORPORATION
    Inventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
  • Publication number: 20160254622
    Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Application
    Filed: May 11, 2016
    Publication date: September 1, 2016
    Inventors: Akira AKIBA, Mitsuo HASHIMOTO, Shinya MORITA, Shun MITARAI, Mikihiro TAKETOMO, Kazunao ONIKI, Koichi IKEDA
  • Patent number: 9362683
    Abstract: A signal transmission cable has a cable including a dielectric layer and a metallic layer. The signal transmission cable further includes a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Grant
    Filed: January 23, 2014
    Date of Patent: June 7, 2016
    Assignee: SONY CORPORATION
    Inventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
  • Publication number: 20140235102
    Abstract: A signal transmission cable comprises a cable including a dielectric layer and a metallic layer; and a connector having a chip with a terminal. The connector includes a substrate having an organic layer, and a portion of the organic layer extends from the substrate so as to form the dielectric layer of the cable. The metallic layer is located on the dielectric layer and is directly connected to the terminal.
    Type: Application
    Filed: January 23, 2014
    Publication date: August 21, 2014
    Applicant: SONY CORPORATION
    Inventors: Akira Akiba, Mitsuo Hashimoto, Shinya Morita, Shun Mitarai, Mikihiro Taketomo, Kazunao Oniki, Koichi Ikeda
  • Patent number: 7880967
    Abstract: An optical element includes an optical film; a substrate; and an adhesive layer disposed between the optical film and the substrate, wherein the adhesive layer is made of NbOx, where 0<x<2.5.
    Type: Grant
    Filed: November 30, 2007
    Date of Patent: February 1, 2011
    Assignee: Sony Corporation
    Inventors: Mikihiro Taketomo, Toshitaka Kawashima, Yoshihiro Oshima
  • Publication number: 20100186630
    Abstract: Provided is a method of depositing a low-refractive-index film, by which a thin film having uniform composition distribution in the film and having a low refractive index can be formed, a low-refractive-index film deposited by the method of depositing a low-refractive-index film, and furthermore, an antireflection film including the low-refractive-index film. In a method of depositing a low-refractive-index film including depositing a low-refractive-index film composed of MgF2—SiO2 on a substrate 11 by a reactive sputtering method, sputtering deposition is conducted using targets 4A and 4B composed of a sintered body of MgF2—SiO2 by applying an alternating voltage with a frequency in the range of 20 to 90 kHz between the substrate 11 and the targets 4A and 4B in an atmosphere of a mixed gas of an inert gas O2.
    Type: Application
    Filed: May 20, 2008
    Publication date: July 29, 2010
    Applicant: SONY CORPORATION
    Inventors: Mikihiro Taketomo, Toshitaka Kawashima, Yoshihiro Oshima
  • Publication number: 20080158680
    Abstract: An optical element includes an optical film; a substrate; and an adhesive layer disposed between the optical film and the substrate, wherein the adhesive layer is made of NbOx, where 0<x<2.5.
    Type: Application
    Filed: November 30, 2007
    Publication date: July 3, 2008
    Applicant: SONY CORPORATION
    Inventors: Mikihiro Taketomo, Toshitaka Kawashima, Yoshihiro Oshima