Abstract: The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II): (Symbols in the formulae are as described in the Description.

Abstract: The present invention is to provide a dispersant which has excellent dispersibility and which is able to inhibit the oxidation of dispersed particles. Disclosed is a dispersant comprising a graft copolymer having a constitutional unit represented by the following general formula (I) and a constitutional unit represented by the following general formula (II): (Symbols shown in the general formulae (I) and (II) are as described in the Description.

Abstract: The present invention is to provide a metal particle dispersion which has low viscosity and excellent dispersibility and dispersion stability, and in which the precipitation of the metal particles is inhibited.

Abstract: Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 ?m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.

Abstract: Provided is a metal microparticle dispersion including metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.5 ?m; the polymeric dispersant has a polyester skeleton in at least one of a principal chain and a side chain thereof; or the polymeric dispersant has a polyether skeleton in at least one of a principal chain and a side chain thereof; and a content of the above polymeric dispersant is 0.1 to 100 parts by mass based on a content of 100 parts by mass of the metal microparticles. Further, provided is a production process for an electrically conductive substrate, and an electrically conductive substrate produced by the above production process is provided.

Abstract: Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conductivity. The conductive substrate of the present invention is prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section of the metal fine particle sintered film has a void rate of 1% or less.

Abstract: The present invention is to provide a dispersant which has excellent dispersibility and which is able to inhibit the oxidation of dispersed particles. Disclosed is a dispersant comprising a graft copolymer having a constitutional unit represented by the following general formula (I) and a constitutional unit represented by the following general formula (II): (Symbols shown in the general formulae (I) and (II) are as described in the Description.

Abstract: The present invention is to provide a metal particle dispersion for electroconductive substrates, which has high dispersibility and dispersion stability and which is able to form a film that shows high electroconductivity after baking. Disclosed is a metal particle dispersion for electroconductive substrates, comprising metal particles, a dispersant and a solvent, wherein the dispersant is a graft copolymer having at least a constitutional unit represented by the following chemical formula (I) and a constitutional unit represented by the following chemical formula (II): (Symbols in the formulae are as described in the Description.

Abstract: The present invention is to provide a metal particle dispersion which has low viscosity and excellent dispersibility and dispersion stability, and in which the precipitation of the metal particles is inhibited.

Abstract: Provided are a metal microparticle dispersion which is excellent in a dispersibility, an electrically conductive substrate which is obtained by using the above metal microparticle dispersion and which is excellent in an electrical conductivity and a production process for the same. Provided is a metal microparticle dispersion comprising metal microparticles, a polymeric dispersant and a dispersion medium, wherein an average primary particle diameter of the metal microparticles is 0.001 to 0.

Abstract: Provided is a conductive substrate which is prepared by forming a pattern-shaped metal fine particle sintered film such as a copper wiring and the like on a base material of polyimide and the like and which has a high adhesive property with the base material and is provided with an excellent conductivity. The conductive substrate of the present invention is prepared by printing a coating liquid containing metal or metal oxide fine particles on a base material to form a print layer and subjecting the above print layer to sintering treatment to form a metal fine particle sintered film, wherein a crystallite diameter in the metal fine particle sintered film which is measured by X ray diffraction is 25 nm or more, and a cross section of the metal fine particle sintered film has a void rate of 1% or less.

Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.

Abstract: The photocurable resin composition in the first aspect of the invention comprises, as essential components, (A) a binder resin having photopolymerizable functional groups and (B) inorganic superfine particles in the order of sub-micron which can be dispersed in a colloidal form; the photocurable resin composition in the second aspect comprises, as essential components, (C) a binder resin containing photopolymerizable functional groups and (D) hydrophobic fine silica particles; and the photocurable resin composition in the third aspect comprises, as essential components, (E) a binder resin containing acrylic resin and urethane acrylate resin and/or polyester acrylate having photopolymerizable functional groups and (F) an organometallic coupling agent.

Abstract: Disclosed is a hologram transfer film which can realize easy and good transfer of a hologram and, at the same time, can realize stable transfer of the hologram in a transfer process. The hologram transfer film comprises: a substrate film; and a transfer layer provided on the substrate film, the transfer layer comprising a hologram-forming layer and a heat-sensitive adhesive layer provided in that order on the substrate film, the hologram-forming layer having a breaking strain of 0.5 to 15% at 25° C. and a breaking strain of 0.5 to 30% at 120° C.

Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.

Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.

Abstract: The photocurable resin composition in the first aspect of the invention comprises, as essential components, (A) a binder resin having photopolymerizable functional groups and (B) inorganic superfine particles in the order of sub-micron which can be dispersed in a colloidal form; the photocurable-resin composition in the second aspect comprises, as essential components, (C) a binder resin containing photopolymerizable functional groups and (D) hydrophobic fine silica particles; and the photocurable resin composition in the third aspect comprises, as essential components, (E) a binder resin containing acrylic resin and urethane acrylate resin and/or polyester acrylate having photopolymerizable functional groups and (F) an organometallic coupling agent.

Abstract: Disclosed is a hologram transfer film which can realize easy and good transfer of a hologram and, at the same time, can realize stable transfer of the hologram in a transfer process. The hologram transfer film comprises: a substrate film; and a transfer layer provided on the substrate film, the transfer layer comprising a hologram-forming layer and a heat-sensitive adhesive layer provided in that order on the substrate film, the hologram-forming layer having a breaking strain of 0.5 to 15% at 25° C. and a breaking strain of 0.5 to 30% at 120° C.

Abstract: Disclosed is a hologram transfer film which can realize easy and good transfer of a hologram and, at the same time, can realize stable transfer of the hologram in a transfer process. The hologram transfer film comprises: a substrate film; and a transfer layer provided on the substrate film, the transfer layer comprising a hologram-forming layer and a heat-sensitive adhesive layer provided in that order on the substrate film, the hologram-forming layer having a breaking strain of 0.5 to 15% at 25° C. and a breaking strain of 0.5 to 30% at 120° C.

Abstract: A hardcoat for a plastic substrate film is provided which has good suitability for printing and satisfactory hardness, can prevent influence of the deformation of a plastic substrate film from extending to the hardcoat, and is resistant to cracking and peeling. The hardcoat is produced from a coating component containing one or more organic components having a polymerizable functional group and an inorganic filler, at least one of the organic components being free from a hydrogen bond-forming group. In the hard coat, the content of the inorganic filler in the surface of the hardcoat is higher than that in the interior of the hardcoat. The hardcoat can be applied to antireflection films and hologram labels.