Abstract: The disclosed cover glass is produced by etching a glass substrate that has been formed by a down-drawing process, and chemically strengthening the glass substrate to provide the glass substrate with a compressive-stress layer on the principal surfaces thereof. The glass substrate contains, as components thereof, 50% to 70% by mass of SiO2, 5% to 20% by mass of Al2O3, 6% to 30% by mass of Na2O, and 0% to less than 8% by mass of Li2O. The glass substrate may also contain 0% to 2.6% by mass of CaO, if necessary. The glass substrate has an etching characteristic in which the etching rate is at least 3.7 ?m/minute in an etching environment having a temperature of 22° C. and containing hydrogen fluoride with a concentration of 10% by mass.

Abstract: The disclosed cover glass is produced by etching a glass substrate that has been formed by a down-drawing process, and chemically strengthening the glass substrate to provide the glass substrate with a compressive-stress layer on the principal surfaces thereof. The glass substrate contains, as components thereof, 50% to 70% by mass of SiO2, 5% to 20% by mass of Al2O3, 6% to 30% by mass of Na2O, and 0% to less than 8% by mass of Li2O. The glass substrate may also contain 0% to 2.6% by mass of CaO, if necessary. The glass substrate has an etching characteristic in which the etching rate is at least 3.7 ?m/minute in an etching environment having a temperature of 22° C. and containing hydrogen fluoride with a concentration of 10% by mass.

Abstract: The disclosed cover glass is produced by etching a glass substrate that has been formed by a down-drawing process, and chemically strengthening the glass substrate to provide the glass substrate with a compressive-stress layer on the principal surfaces thereof. The glass substrate contains, as components thereof, 50% to 70% by mass of SiO2, 5% to 20% by mass of Al2O3, 6% to 30% by mass of Na2O, and 0% to less than 8% by mass of Li2O. The glass substrate may also contain 0% to 2.6% by mass of CaO, if necessary. The glass substrate has an etching characteristic in which the etching rate is at least 3.7 ?m/minute in an etching environment having a temperature of 22° C. and containing hydrogen fluoride with a concentration of 10% by mass.

Abstract: Provided is a cover glass having a down-drawable composition including, in mass percent: 50%-70% SiO2, 5%-20% Al2O3, 6%-20% Na2O, 0%-10% K2O, 0%-10% MgO, above 2%-20% CaO, and 0%-4.8% ZrO2 wherein, (i) 46.5%?(SiO2?½Al2O3)?59%, (ii) 0.3<CaO/RO, where RO represents a total mass percent of one or more compounds selected from the group consisting of MgO, CaO, SrO and BaO included in the glass substrate, (iii) SrO+BaO<10%, (iv) 0?(ZrO2+TiO2)/SiO2)<0.07, and (v) 0?B2O3/R12O<0.1, where R12O represents a total mass percent of one or more compounds selected from the group consisting of Li2O, Na2O and K2O included in the glass substrate.