Patents by Inventor Mikiko Tanaka
Mikiko Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8413907Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: May 10, 2012Date of Patent: April 9, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Patent number: 8302055Abstract: A semiconductor device design support apparatus includes an input unit which inputs layout information, LSI design information, switching information, a primitive library, an electrical current waveform computation unit which obtains an electrical current waveform in instance units, an electrical current dispersion value computation unit which obtains electrical current dispersion values of each segment, a segment dividing unit which judges whether or not the electrical current dispersion value of a segment is not less than a permitted value and divides the segment in cases in which the electrical current dispersion value is not less than the permitted value, a macro-model creation unit which creates a macro-model for each segment; a substrate netlist extraction unit which extracts a substrate netlist, and a substrate noise analysis netlist creation unit which creates a substrate noise analysis netlist from a macro-model of each segment and the substrate netlist.Type: GrantFiled: April 22, 2009Date of Patent: October 30, 2012Assignee: Renesas Electronics CorporationInventor: Mikiko Tanaka
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Publication number: 20120217312Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: May 10, 2012Publication date: August 30, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Patent number: 8191791Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: February 8, 2011Date of Patent: June 5, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Patent number: 8176455Abstract: A semiconductor device design support apparatus for generating a substrate netlist so as to be able to perform substrate noise analysis with high accuracy in a short time. The semiconductor device design support apparatus comprises a unit that divides a semiconductor device layout into a plurality of segments and generates a macro-model of the segments by using a current waveform of an instance included in the divided segments; a unit that replaces a pattern (termed as “substrate interface”) that is designed to be an interface with a substrate with respect to the segments, by a prescribed substrate interface diagram; and a unit that generates a substrate netlist, based on the substrate interface diagram of the plurality of segments.Type: GrantFiled: September 3, 2009Date of Patent: May 8, 2012Assignee: Renesas Electronics CorporationInventor: Mikiko Tanaka
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Patent number: 7997501Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: August 16, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20110127337Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: February 8, 2011Publication date: June 2, 2011Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA
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Patent number: 7905421Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: GrantFiled: July 15, 2009Date of Patent: March 15, 2011Assignee: Murata Manufacturing Co., Ltd.Inventors: Nobuo Ikemoto, Satoshi Ishino, Yuya Dokai, Noboru Kato, Takeshi Kataya, Ikuhei Kimura, Mikiko Tanaka
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Publication number: 20100064267Abstract: A semiconductor device design support apparatus for generating a substrate netlist so as to be able to perform substrate noise analysis with high accuracy in a short time. The semiconductor device design support apparatus comprises a unit that divides a semiconductor device layout into a plurality of segments and generates a macro-model of the segments by using a current waveform of an instance included in the divided segments; a unit that replaces a pattern (termed as “substrate interface”) that is designed to be an interface with a substrate with respect to the segments, by a prescribed substrate interface diagram; and a unit that generates a substrate netlist, based on the substrate interface diagram of the plurality of segments.Type: ApplicationFiled: September 3, 2009Publication date: March 11, 2010Applicant: NEC ELECTRONICS CORPORATIONInventor: Mikiko Tanaka
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Publication number: 20090282378Abstract: A semiconductor device design support apparatus comprises: an input unit (101) which inputs layout information (108), LSI design information (109), switching information (110), a primitive library (111); an electrical current waveform computation unit (102) which obtains an electrical current waveform in instance units; an electrical current dispersion value computation unit (103) which obtains electrical current dispersion values of each segment; a segment dividing unit (104) which judges whether or not the electrical current dispersion value of a segment is not less than a permitted value and divides the segment in cases in which the electrical current dispersion value is not less than the permitted value; a macro-model creation unit (105) which creates a macro-model for each segment; a substrate netlist extraction unit (106) which extracts a substrate netlist; and a substrate noise analysis netlist creation unit (107) which creates a substrate noise analysis netlist from a macro-model of each segment and tType: ApplicationFiled: April 22, 2009Publication date: November 12, 2009Applicant: NEC Electronics CorporationInventor: Mikiko Tanaka
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Publication number: 20090266900Abstract: A wireless IC device that is miniaturized, allows simple and low-cost mounting of a wireless IC, and eliminates the possibility of damage occurring to the wireless IC due to static electricity, and an electronic apparatus equipped with the wireless IC device, includes a wireless IC chip that processes transmission and reception signals, and a feeder circuit substrate that includes a resonant circuit having an inductance element. Feeder electrodes are provided on a surface of the feeder circuit substrate and are electromagnetically coupled to the resonant circuit. The feeder electrodes and are electromagnetically coupled to radiation plates and provided for a printed wiring board. The wireless IC chip is activated by a signal received by the radiation plates and a response signal from the wireless IC chip is radiated outward from the radiation plates.Type: ApplicationFiled: July 15, 2009Publication date: October 29, 2009Applicant: Murata Manufacturing Co., Ltd.Inventors: Nobuo IKEMOTO, Satoshi ISHINO, Yuya DOKAI, Noboru KATO, Takeshi KATAYA, Ikuhei KIMURA, Mikiko TANAKA