Abstract: A polishing liquid is provided containing manganese oxide abrasive grains, permanganate ions, and a cellulosic surfactant or a cationic surfactant. The polishing liquid has a pH of 5 or more and 11 or less. The cellulosic surfactant is preferably a carboxymethyl cellulose or a derivative thereof. The cationic surfactant preferably has a quaternary ammonium ion site. The content of the cellulosic surfactant or the cationic surfactant is preferably 0.01 mass % or more and 1.0 mass % or less based on the total amount of the polishing liquid.

Abstract: A polishing liquid is provided containing manganese oxide abrasive grains, permanganate ions, and a cellulosic surfactant or a cationic surfactant. The polishing liquid has a pH of 5 or more and 11 or less. The cellulosic surfactant is preferably a carboxymethyl cellulose or a derivative thereof. The cationic surfactant preferably has a quaternary ammonium ion site. The content of the cellulosic surfactant or the cationic surfactant is preferably 0.01 mass % or more and 1.0 mass % or less based on the total amount of the polishing liquid.

Abstract: The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size DSEM of the longitudinal axis of the observed particles is 1.0 ?m or less, and if the particle size D50 of the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 ?m or less.

Abstract: The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size DSEM of the longitudinal axis of the observed particles is 1.0 ?m or less, and if the particle size D50 of the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 ?m or less.

Abstract: The present invention provides a polishing technique capable of polishing, at a high speed, a substrate containing Al and having high hardness, such as single-crystal sapphire substrate, and capable of providing a polished surface of high accuracy. The present invention relates to a polishing slurry for polishing a substrate containing aluminum, comprising abrasive grains, an inorganic boron compound having a solubility in water at 20° C. of 0.1 g/100 g—H2O or more, and water. In the present invention, it is preferable that the content of the inorganic boron compound is 0.1% by mass to 20% by mass in terms of boron atoms based on the polishing slurry.

Abstract: A nickel ink having nickel particles dispersed in a dispersion medium is disclosed. The dispersion medium comprises one member or a combination of two or more members selected from the group consisting of an alcohol and a glycol both having a boiling point of 300° C. or lower at atmospheric pressure. The nickel particles have an average primary particle size of 50 nm or smaller. The nickel ink provides a conductor film with a surface smoothness having an average surface roughness Ra of 10 nm or smaller and a maximum surface roughness Rmax of 200 nm or smaller.

Abstract: The present invention provides a polishing technique which enables polishing of silicon carbide, which is difficult to be polished, with high efficiency and high surface accuracy. The present invention relates to a polishing slurry for polishing a substrate, which comprises abrasive particles containing manganese oxide as a main component and in which the content of the abrasive particles is less than 10% by weight based on the polishing slurry. The polishing slurry of the present invention has a pH of preferably 7 or more. It is particularly preferable to use manganese dioxide as abrasive particles. The polishing slurry of the present invention is suitable for a substrate of silicon carbide.

Abstract: The present invention provides an abrasive material capable of polishing difficult-to-polish silicon carbide at a high degree of surface precision. The present invention relates to an abrasive material including manganese dioxide particles having a non-needle-like shape possessing a ratio of the longitudinal axis to the transverse axis of the particles observed with a scanning electron microscope of 3.0 or less. The abrasive material is preferable if the average particle size DSEM of the longitudinal axis of the observed particles is 1.0 ?m or less, and if the particle size D50 of the volume-based cumulative fraction of 50% in laser diffraction/scattering particle size distribution measurement is 2.0 ?m or less.

Abstract: It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to form a conductor having high film density and low electric resistance. In order to attain the object, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C. or less at normal pressure.

Abstract: Disclosed is a nickel ink comprising a dispersion medium and nickel particles dispersed in the medium and containing a methyldimethoxysilane coupling agent. The dispersion medium comprises a glycol having a boiling point of 300° C. or lower at ambient temperature, an alkoxyethanol having 3 to 10 carbon atoms, and an ether having 2 to 8 carbon atoms. The ink preferably has a surface tension adjusted to 15 to 50 mN/m and a viscosity at 25° C. adjusted to 0.6 to 60 mPa·sec. The ink is preferably used in inkjet printing.

Abstract: A nickel ink having nickel particles dispersed in a dispersion medium is disclosed. The dispersion medium comprises one member or a combination of two or more members selected from the group consisting of an alcohol and a glycol both having a boiling point of 300° C. or lower at atmospheric pressure. The nickel particles have an average primary particle size of 50 nm or smaller. The nickel ink provides a conductor film with a surface smoothness having an average surface roughness Ra of 10 nm or smaller and a maximum surface roughness Rmax of 200 nm or smaller.

Abstract: Disclosed is a nickel ink which is obtained by dispersing nickel particles in a dispersion medium. This nickel ink contains a methyldimethoxysilane coupling agent. The dispersion medium contains a glycol having a boiling point at room temperature of not more than 300 & ring; C, an alkoxyethanol having 3-10 carbon atoms, and an ether having carbon atoms. The ink is preferably controlled to have a surface tension of 15-50 mN/m and a viscosity at 25 & ring; C of 0.6-60 mPa-sec. This ink is preferably used in inkjet printing systems.

Abstract: It is an object of the present invention to provide a conductive ink which enables to form a circuit or the like having excellent adhesion to a substrate and to form a conductor having high film density and low electric resistance. In order to attain the object, a conductive ink comprising metal powder or metal oxide powder dispersed in a dispersion medium, which is characterized in that the dispersion medium contains a metal salt or a metal oxide as a film density improver for increasing film density of a conductor formed by using the conductive ink is adopted. A main solvent constituting the dispersion medium is selected from one or a combination of two or more selected from the group consisting of water, alcohols, glycols and saturated hydrocarbons having a boiling point of 300 deg. C. or less at normal pressure.