Patents by Inventor Mikio Aoki

Mikio Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250144071
    Abstract: An object of the present disclosure is to provide a novel method for producing an ellagic acid-containing composition, the method capable of improving the solubility of ellagic acid. The present embodiment is a method for producing an ellagic acid-containing composition, including: a step of providing a solution containing at least an aqueous medium and a raw material derived from a plant of the genus Terminalia, containing ellagic acid; and a step of heat-treating the solution. The present embodiment is the production method, further including a step of a hydrolysis treatment to hydrolyze ellagitannin contained in the raw material to produce additional ellagic acid, wherein the hydrolysis-treated solution is heat-treated.
    Type: Application
    Filed: March 24, 2023
    Publication date: May 8, 2025
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Toshihiro YONEYAMA, Masanori KUSUMOTO, Mikio AOKI, Kazuki MIKATA
  • Publication number: 20250099514
    Abstract: Provided are: a fish rearing composition containing at least one selected from plantaricin and nisin; and a fish rearing composition containing bacterial cells or a cell culture product of a bacterium having at least one selected from a plantaricin gene and a nisin gene, or an extract thereof. Provided is a method for rearing an organism of fish, including administering bacterial cells or a cell culture product of a bacterium having at least one selected from a plantaricin gene and a nisin gene, or an extract thereof.
    Type: Application
    Filed: July 8, 2022
    Publication date: March 27, 2025
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Mikio AOKI, Kazuki MIKATA, Toshihiro KAI, Hiroshi KUWAHARA, Ikuo HIRONO, Hidehiro KONDO
  • Publication number: 20240408185
    Abstract: An aspect of the present invention is directed to provide a novel dipeptidyl peptidase IV (DPP-4) inhibitor and a production method thereof. The DPP-4 inhibitor according to an aspect of the present invention contains a hydrolysate obtained by hydrolyzing a protein derived from a microorganism. An article according to another aspect of the present invention for preventing and/or improving abnormality involving DPP-4 contains the DPP-4 inhibitor. A method for producing the DPP-4 inhibitor according to another aspect of the present invention includes a step of hydrolyzing a protein derived from a microorganism with a protease.
    Type: Application
    Filed: November 2, 2022
    Publication date: December 12, 2024
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Masanori KUSUMOTO, Toshihiro YONEYAMA, Mikio AOKI, Kazuki MIKATA
  • Publication number: 20240335486
    Abstract: Provided are: a composition for rearing an organism belonging to the order Decapoda, comprising bacterial cells or a cell culture product of at least one bacterium selected from NITE-BP-03199, NITE-BP-03200, and NITE-BP-03201, or an extract thereof; and a method for rearing an organism belonging to the order Decapoda using the same. Provided are: a composition for preventing or treating an infection caused by a Vibrio bacterium in a decapod, comprising bacterial cells or a cell culture product of at least one bacterium selected from NITE-BP-03199, NITE-BP-03200, and NITE-BP-03201, or an extract thereof; and a method for preventing or treating an infection in a decapod using the same.
    Type: Application
    Filed: July 8, 2022
    Publication date: October 10, 2024
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Mikio AOKI, Kazuki MIKATA, Toshihiro KAI, Ikuo HIRONO, HIdehiro KONDO, Sana MATSUMOTO
  • Publication number: 20230292761
    Abstract: Provided are a bacterium having a 16S rRNA gene that contains a nucleotide sequence with 98.80% or more identity to the nucleotide sequence of SEQ ID No: 1 and having the ability to assimilate mannitol and the ability to control a plant disease and a bacterium with Accession Number of NITE BP-03197, NITE BP-03198, NITE BP-03199, NITE BP-03200, NITE BP-03201, or NITE BP-03202, and a control agent against a plant disease caused by Ralstonia solanacearum or Ralstonia pseudosolanacearum, containing bacterial cells or a cell culture product of the bacterium, or an extract thereof.
    Type: Application
    Filed: June 23, 2021
    Publication date: September 21, 2023
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Mikio AOKI, Naoya OZAWA
  • Patent number: 11150611
    Abstract: There is provided a wearable device including: a display that displays time; and a processor, in which the processor includes an acquisition unit that acquires moving object information related to a moving object which moves to a destination place and a time difference of the destination place with respect to standard time, and a correction unit that corrects the time to be displayed on the display unit based on the time difference when it is determined that a predetermined condition related to arrival of the moving object to the destination place is satisfied based on the moving object information.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: October 19, 2021
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Mikio Aoki, Hiroshi Matsushita
  • Patent number: 10868364
    Abstract: Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: December 15, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Takehiko Kai, Masaya Shimamura, Mikio Aoki, Jin Mikata, Taiji Ito
  • Patent number: 10756024
    Abstract: An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: August 25, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Takehiko Kai, Masaya Shimamura, Mikio Aoki, Jin Mikata, Taiji Ito
  • Patent number: 10714822
    Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate and serving as an antenna; a resin layer sealing the electronic circuit in the first region; and a shielding layer formed on a surface of the resin layer and having conductivity.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: July 14, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Jin Mikata, Masaya Shimamura, Mikio Aoki, Takehiko Kai, Taiji Ito
  • Patent number: 10665936
    Abstract: A wireless module, including: a substrate; an electronic circuit mounted in a first region on a one face of the substrate; a conductive pattern formed in a second region on another face of the substrate, the conductive pattern being connected to a radio communication section of the electronic circuit, and the conductive pattern serving as an antenna when transmitting/receiving radio wave, the second region being different from the first region; a resin layer sealing the electronic circuit in the first region; a shielding layer formed on a surface of the resin layer; and a shield disposed in either one of a top layer of the substrate and an inner layer of the substrate, the shield being for shielding noise radiated from the electronic circuit.
    Type: Grant
    Filed: November 30, 2017
    Date of Patent: May 26, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Jin Mikata, Masaya Shimamura, Mikio Aoki, Takehiko Kai, Taiji Ito
  • Patent number: 10529668
    Abstract: Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: January 7, 2020
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Takehiko Kai, Masaya Shimamura, Mikio Aoki, Jin Mikata, Taiji Ito
  • Publication number: 20190377303
    Abstract: There is provided a wearable device including: a display that displays time; and a processor, in which the processor includes an acquisition unit that acquires moving object information related to a moving object which moves to a destination place and a time difference of the destination place with respect to standard time, and a correction unit that corrects the time to be displayed on the display unit based on the time difference when it is determined that a predetermined condition related to arrival of the moving object to the destination place is satisfied based on the moving object information.
    Type: Application
    Filed: June 7, 2019
    Publication date: December 12, 2019
    Applicant: SEIKO EPSON CORPORATION
    Inventors: Mikio AOKI, Hiroshi MATSUSHITA
  • Publication number: 20190369124
    Abstract: The present invention provides an agent for determining Alzheimer's disease, comprising an anti-S38AA antibody, a method of determining Alzheimer's disease in a test animal, comprising detecting an S38AA fragment in a sample collected from said animal, and a method of screening for a substance that treats or prevents Alzheimer's disease, comprising contacting a test substance with a cell permitting measurement of production of a S38AA fragment, measuring the production amount of the S38AA fragment in the cell, and comparing the production amount with that of the S38AA fragment in a control cell free of contact with the test substance, and selecting a test substance that down-regulates the production amount of the S38AA fragment as a substance capable of treating or preventing Alzheimer's disease, based on the comparison results.
    Type: Application
    Filed: August 19, 2019
    Publication date: December 5, 2019
    Applicant: Sumitomo Dainippon Pharma Co., Ltd.
    Inventors: Masakazu HASHIMOTO, Hiroyuki NAKAGAWA, Mikio AOKI, Lars O. TJERNBERG, Bengt WINBLAD
  • Patent number: 10490512
    Abstract: A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.
    Type: Grant
    Filed: April 10, 2019
    Date of Patent: November 26, 2019
    Assignee: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Takehiko Kai, Masaya Shimamura, Mikio Aoki, Jin Mikata, Taiji Ito
  • Patent number: 10393757
    Abstract: The present invention provides an agent for determining Alzheimer's disease, comprising an anti-S38AA antibody, a method of determining Alzheimer's disease in a test animal, comprising detecting an S38AA fragment in a sample collected from said animal, and a method of screening for a substance that treats or prevents Alzheimer's disease, comprising contacting a test substance with a cell permitting measurement of production of a S38AA fragment, measuring the production amount of the S38AA fragment in the cell, and comparing the production amount with that of the S38AA fragment in a control cell free of contact with the test substance, and selecting a test substance that down-regulates the production amount of the S38AA fragment as a substance capable of treating or preventing Alzheimer's disease, based on the comparison results.
    Type: Grant
    Filed: December 28, 2011
    Date of Patent: August 27, 2019
    Assignee: DAINIPPON SUMITOMO PHARMA CO., LTD.
    Inventors: Masakazu Hashimoto, Hiroyuki Nakagawa, Mikio Aoki, Lars O. Tjernberg, Bengt Winblad
  • Publication number: 20190237409
    Abstract: A method of manufacturing a plurality of identical electronic component modules includes: preparing an assembly substrate that includes a plurality of electronic components mounted thereon; digging a first groove along the dicing lines from a top surface of a sealing member that seals each electronic component, the first groove penetrating the sealing member and reaching an intermediate depth within a base substrate; widening an upper portion of the first grove to define a second groove that is continuous with the lower portion of the first groove; forming a shielding film by depositing a film made of a conductive material on the top surface of the sealing member and on inner walls of the first and second grooves that include the sidewalls of the sealing member; and thereafter, cutting the base substrate at a bottom of the lower portion of the first groove along dicing lines.
    Type: Application
    Filed: April 10, 2019
    Publication date: August 1, 2019
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286816
    Abstract: To provide an electronic component module capable of forming a shielding film in a state of an assembly substrate and enhancing productivity. An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and the substrate, the sealing portion having an upper surface and a side surface, the upper surface and the side surface forming an edge portion; a contact portion provided to the substrate, the contact portion being configured to be electrically connected with the conductive pattern, the contact portion having a vertical surface continuous with the side surface of the sealing portion and a horizontal surface continuous with the vertical surface; and a shielding film covering the upper surface and the side surface of the sealing portion and the contact portion.
    Type: Application
    Filed: March 23, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286817
    Abstract: Forming a groove in a dicing region so as to expose a conductive pattern material on a side surface, closer to a first side of each of mounting regions, of a substrate; when forming a first sealing portion enclosing a wireless region and a second sealing portion enclosing an antenna region adjacent to the wireless region on a side of a second side of each of the mounting regions, reducing a thickness in a height direction such that a thickness of the second sealing portion becomes smaller in thickness than a thickness of the first sealing portion; forming a shielding film such that a scattered matter made of a conductive material is allowed to pass through an upper surface of the second sealing portion, to be deposited onto the conductive pattern material exposed on a side surface of the substrate; and separating the substrate into the mounting regions individually.
    Type: Application
    Filed: March 26, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo KITAZAKI, Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO
  • Publication number: 20180286796
    Abstract: An electronic component module includes: a substrate including a conductive pattern; an electronic component provided to the substrate; a sealing portion covering the electronic component and substrate, and having an upper surface and a side surface that form an edge portion; a contact portion configured to be electrically connected with the conductive pattern, the contact portion exposed on a vertical surface continuous with the side surface of the sealing portion; a removal portion formed by removing the predetermined edge portion formed by the upper surface and the side surface of the sealing portion; and a shielding film covering the upper surface, the side surface and the contact portion of the sealing portion. The removal portion is a region allowing a conductive material to pass therethrough so that the contact portion is covered with the shielding film, the conductive material being scattered in vacuum atmosphere lower than atmospheric pressure.
    Type: Application
    Filed: March 23, 2018
    Publication date: October 4, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Kenzo Kitazaki, Takehiko Kai, Masaya Shimamura, Mikio Aoki, Jin Mikata, Taiji Ito
  • Publication number: 20180159216
    Abstract: Solution is preparing a substrate; covering an electronic component mounting region and an antenna mounting region of the substrate with a resin material having viscosity or fluidity; curing the resin material to form a resin layer, and thereafter performing grinding or polishing so as to substantially flatten a surface of the resin layer on the electronic component mounting region and the antenna mounting region; and covering the flattened resin layer with a shielding material having viscosity or fluidity.
    Type: Application
    Filed: November 30, 2017
    Publication date: June 7, 2018
    Applicant: TAIYO YUDEN CO., LTD.
    Inventors: Takehiko KAI, Masaya SHIMAMURA, Mikio AOKI, Jin MIKATA, Taiji ITO