Abstract: A structure (10) includes a formed body (1) of a predetermined shape and a liquid film (3) formed on the surface thereof, the liquid film (3) being formed by using a dispersion solution obtained by dispersing, in a dispersion medium, a liquid that is incompatible therewith. The structure (10) exhibits slipping property to the emulsified product maintaining stability. Also disclosed is a method for producing the structure.

Abstract: A structured body (10) includes a base material (1) formed into a predetermined shape and a liquid film (3) provided on a surface thereof, and droplets (5) of a liquid incompatible with a liquid for the liquid film (3) are distributed on the liquid film (3).

Abstract: A structure (10) includes a formed body (1) of a predetermined shape and a liquid film (3) formed on the surface thereof, the liquid film (3) being formed by using a dispersion solution obtained by dispersing, in a dispersion medium, a liquid that is incompatible therewith. The structure (10) exhibits slipping property to the emulsified product maintaining stability. Also disclosed is a method for producing the structure.

Abstract: In a semiconductor memory unit to which a plurality of different functions can be imparted by merely changing a portion of its production process, the improvement comprises: a plurality of data buses which include first data buses for use only in one of the functions and the remaining data buses for use in the one and the remainder of the functions; wherein when the semiconductor memory unit performs the remainder of the functions, the first data buses are utilized for the semiconductor memory unit.

Abstract: Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss?, and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss?.

Abstract: Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss′, and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss′.

Abstract: A semiconductor memory device includes a command decoder receiving an external signal and issuing a command, a clock buffer receiving an external clock, gates and a refresh counter. When a test signal is at L-level, an auto-refresh signal is issued in accordance with the output of the command decoder. When the test signal is at H-level, the auto-refresh signal is issued in accordance with the output (external clock) of the clock buffer. Thereby, the test can be performed with a good timing accuracy even by a low-speed tester.

Abstract: A tester is connected to a signal output terminal provided in a DRAM chip, and a frequency of a clock signal output from an internal timer is monitored. The frequency of the clock signal is varied by changing the combination of 3 bit signals, so as to obtain signals by which the frequency closest to the set value is obtained. A fuse in the internal timer is disconnected to set the frequency of the clock signal so as to obtain the same state as in the case where that signal is applied. The internal timer includes an oscillator formed of a plurality of inverters connected in ring shape and a variable capacitance circuit for each inverter. Each variable capacitance circuit includes a plurality of sets of transfer gates, fuses and capacitors connected between the output node of the corresponding inverter and a prescribed potential line.

Abstract: In response to an output data width switching mode signal, a predecoder zone+selector zone outputs selection signals SEL0 to SEL7 and WORDA to WORDC to a preamplifier+write driver zone. The preamplifier+write driver zone can switch connection between global I/O lines GIO<0> to GIO<7> and a data bus in response to these selection signals. Read data is output to a pad without through a selector circuit or the like on the data bus, whereby a simple structure can be obtained with no critical adjustment of a delay time resulting from mode switching or address change.

Abstract: A semiconductor memory device includes a command decoder receiving an external signal and issuing a command, a clock buffer receiving an external clock, gates and a refresh counter. When a test signal is at L-level, an auto-refresh signal is issued in accordance with the output of the command decoder. When the test signal is at H-level, the auto-refresh signal is issued in accordance with the output (external clock) of the clock buffer. Thereby, the test can be performed with a good timing accuracy even by a low-speed tester.

Abstract: A semiconductor memory device includes a command decoder receiving an external signal and issuing a command, a clock buffer receiving an external clock, gates and a refresh counter. When a test signal is at L-level, an auto-refresh signal is issued in accordance with the output of the command decoder. When the test signal is at H-level, the auto-refresh signal is issued in accordance with the output (external clock) of the clock buffer. Thereby, the test can be performed with a good timing accuracy even by a low-speed tester.

Abstract: In response to an output data width switching mode signal, a predecoder zone+selector zone outputs selection signals SEL0 to SEL7 and WORDA to WORDC to a preamplifier+write driver zone. The preamplifier+write driver zone can switch connection between global I/O lines GIO<0> to GIO<7> and a data bus in response to these selection signals. Read data is output to a pad without through a selector circuit or the like on the data bus, whereby a simple structure can be obtained with no critical adjustment of a delay time resulting from mode switching or address change.

Abstract: A test signal generating circuit generates internal test control signals from a small number of signals supplied via an address terminal in a test mode operation. According to the test control signals, the values of internal row address signal bits from an address buffer are set, while a row-related control circuit with test control function controls operations of a row selection circuit and bit line peripheral circuitry according to the test control signals. A plurality of word lines are driven simultaneously into a selected state and an acceleration test is performed according to a small number of control signals in a short period of time. Voltage stress applied between memory cell capacitors and between word lines can be accelerated with a small number of control signals.

Abstract: In a semiconductor memory unit to which a plurality of different functions can be imparted by merely changing a portion of its production process, the improvement comprises: a plurality of data buses which include first data buses for use only in one of the functions and the remaining data buses for use in the one and the remainder of the functions; wherein when the semiconductor memory unit performs the remainder of the functions, the first data buses are utilized for the semiconductor memory unit.

Abstract: In response to an output data width switching mode signal, a predecoder zone+selector zone outputs selection signals SEL0 to SEL7 and WORDA to WORDC to a preamplifier+write driver zone. The preamplifier+write driver zone can switch connection between global I/O lines GIO<0> to GIO<7> and a data bus in response to these selection signals. Read data is output to a pad without through a selector circuit or the like on the data bus, whereby a simple structure can be obtained with no critical adjustment of a delay time resulting from mode switching or address change.

Abstract: A semiconductor memory device includes a plurality of array blocks including word lines, memory cells, bit lines, dummy word lines and transistors. In a test mode, rather than a word line a dummy word line is selected. Selectively turning on either one of the transistors allows a bit line connected thereto to be driven to a ground potential. Thus, a channel leak can be detected. In a mode other than the test mode, a defective word line is substituted by a spare word line included in a spare block.

Abstract: A semiconductor memory device includes: a memory cell region constructed of blocks and a memory cell region constructed of blocks. The blocks and the blocks are continuously disposed. A block decoder outputs block select signals to the respective blocks. As a result, power consumption of the semiconductor memory device is reduced.

Abstract: Complementary sub-decode signals to be provided to a sub-word line driver are separately generated through different circuits using individual power-supply voltages. Thus, the generation of a through current in the sub-word line driver is prevented.

Abstract: Pads are alignedly arranged in a central region of a semiconductor chip and are also arranged at an outer peripheral portion of the central portion of the chip. A pad at the outer peripheral portion is electrically connected to a die pad mounting the chip thereon with an insulative material interposed therebetween. A potential supplied to the pad positioned at the outer peripheral portion can be stabilized by parasitic capacitance of the die pad, and a potential of the die pad can be externally monitored easily by removing away a portion of mold resin after resin sealing. Further, due to a cress shaped arrangement of the pads, a voltage down converter can be arranged in line with the pads and at outer periphery of the chip without area penalty. In testing operation, a switching circuit switches a function of a pad to another pad so that cross-shapedly arranged pads are equivalently arranged in a line.

Abstract: Drains of first and second transistors are connected to a low level line of an internal circuitry such as a sense amplifier related to determination of a potential in a memory cell. The first transistor has its gate diode-connected to a sense drive line and its source grounded. The second transistor receives at its gate an internally generated signal, and its source is grounded. In the standby state, the potential of the sense drive line is set higher than low level of said word lines by the threshold voltage Vthn of the first transistor and used as dummy GND potential Vss′, and in the active state, the second transistor is rendered conductive so as to prevent floating of the sense drive line from the dummy GND potential Vss′.