Patents by Inventor Mikio DAIGO

Mikio DAIGO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10014637
    Abstract: A device is equipped with an electrical connector in the form of a receptacle that is subject to liquid intrusion. The device detects the insertion of a mating connector and optionally detects the presence of liquid in the receptacle by applying a low power, pulsed sense signal to a terminal pin of the receptacle while the terminal pin is decoupled from a circuit part to which the terminal pin is normally coupled and concurrently sensing a voltage coupled from the terminal pin and comparing the voltage to at least a predetermined lower voltage bound and optionally a predetermined upper voltage bound and based on the results of those comparison deduces the presence of a mating connector or optionally the presence of liquid in the receptacle.
    Type: Grant
    Filed: October 20, 2015
    Date of Patent: July 3, 2018
    Assignee: Sony Mobile Communications Inc.
    Inventors: Hiroyuki Hasegawa, Mikio Daigo, Kazuhiro Kuroda, Hiroki Nitta
  • Publication number: 20170110835
    Abstract: A device is equipped with an electrical connector in the form of a receptacle that is subject to liquid intrusion. The device detects the insertion of a mating connector and optionally detects the presence of liquid in the receptacle by applying a low power, pulsed sense signal to a terminal pin of the receptacle while the terminal pin is decoupled from a circuit part to which the terminal pin is normally coupled and concurrently sensing a voltage coupled from the terminal pin and comparing the voltage to at least a predetermined lower voltage bound and optionally a predetermined upper voltage bound and based on the results of those comparison deduces the presence of a mating connector or optionally the presence of liquid in the receptacle.
    Type: Application
    Filed: October 20, 2015
    Publication date: April 20, 2017
    Applicant: Sony Mobile Communications Inc.
    Inventors: Hiroyuki HASEGAWA, Mikio DAIGO, Kazuhiro KURODA, Hiroki NITTA