Abstract: A vehicle body structure includes a rear floor panel on which a spare tire is placed at a predetermined position, an electric component fixed on the rear floor panel, and a cover member that is fixed on the rear floor panel and covers the electric component, wherein the cover member includes an inclined surface that is inclined with respect to the rear floor panel so as to collide with the spare tire pushed out from the predetermined position, load durability of the rear floor panel is lower than load durability of the cover member, and a space into which the electric component is pushed is provided below the electric component with the rear floor panel interposed between the space and the electric component.

Abstract: A lead frame has a plurality of metallic heat radiating plates, leads connected to each metallic heat radiating plate, other leads separated from the metallic heat radiating plates and a common insulator web attached to the metallic heat radiating plates. When the lead frame is placed in the cavity of a mold, the metallic heat radiating plates are correctly positioned in the mold cavity by the insulating web and the connected leads. By effecting a resin molding under this condition, the metallic heat radiating plates are molded in resin such that a layer of resin with a uniform thickness cover the back surface of the respective metallic heat radiating plates.

Abstract: A semiconductor device comprises a semiconductor substrate, a vertical transistor formed in the substrate, highly doped regions selectively and concurrently formed within the base region and the collector region by ion-implantation method etc., respectively, the one highly doped region within the collector region being spaced from the base region, the other highly doped regions within the base region serving as base ohmic contact regions, a clamping diode consisting of a junction between the one highly doped region and the collector region and having breakdown voltage lower than a breakdown voltage across the collector and the emitter regions of the transistor, and a connection conductor formed on the substrate so as to electrically connect the one of the base ohmic contact regions with the one highly doped region for forming the junction of the clamping diode. The transistor device provided with the above-featured clamping diode structure can prevent undesired parasitic transistor effect from being produced.

Abstract: A lead frame has a plurality of metallic heat radiating plates, leads connected to each metallic heat radiating plate, other leads separated from the metallic heat radiating plates and a common insulator web attached to the metallic heat radiating plates. When the lead frame is placed in the cavity of a mold, the metallic heat radiating plates are correctly positioned in the mold cavity by means of the insulating web and the connected leads. By effecting a resin molding under this condition, the metallic heat radiating plates are molded in resin such that a layer of resin with a uniform thickness cover the back surface of the respective metallic heat radiating plates.