Abstract: Disclosed is a method of manufacturing a casing for an electronic equipment, the casing having a rib of a predetermined height and an insertion hole formed inside the rib in the width direction. The manufacturing method comprises the steps of preparing a molded article having a rib of a predetermined height and a concave portion positioned inside the rib in the width direction, the concave portion having a bottom wall portion, allowing a concave portion supporting die having a punch insertion hole formed therein to be engaged with the bottom portion so as to fix the molded article, and moving a punch from a side opposite to the bottom portion of the molded article engaged with the concave portion supporting die so as to punch the bottom portion positioned inside a punch insertion hole and, thus, to form an insertion hole.

Abstract: In a mold device comprising pin members provided projecting from an upper mold or a lower mold in order to form an electronic apparatus frame of a metallic material having pores arranged at given pitches, the pin members are arranged so that a center line connecting the adjacent pin members is not perpendicular to the direction of introduction of a molten metal into a cavity of the mold device.