Abstract: A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.

Abstract: A die-sorting sheet includes a pressure-sensitive adhesive layer exposed on an outer periphery of the carrier sheet, and a base film exposed on a central area that is inside the outer periphery. A method for transporting a chip having an adhesive layer according to the present invention includes the steps of: providing the above die-sorting sheet that is fixed with a frame through the pressure-sensitive adhesive layer on the outer periphery; temporarily attaching a picked up chip through an adhesive layer thereof onto the base film exposed on the die-sorting sheet; and transporting the die-sorting sheet to a subsequent step while the chip is temporarily attached on the sheet through the adhesive layer.

Abstract: A base material has a radiation-cured material prepared by curing a mixture of urethane acrylate oligomer and reactive dilute monomer, and also it shows a breaking elongation of more than 10%, preferably of more than 100%. The base material is used as a base sheet of an adhesive tape where an adhesive layer is formed on the base sheet. Accordingly, the novel base material and its manufacturing method in addition to an adhesive tape having such base material are provided. Furthermore, the adhesive tape has a flat surface without any fish-eye that causes the troubles of cracking, chip-scattering, and so on in the steps of back-grinding and dicing of the semiconductor wafer, and also the adhesive tape can be processed so as to have a predetermined thickness with high accuracy, compared with that of the conventional one.

Abstract: The present invention provides a cover tape comprising a tapelike base material 1, adhesive parts 2 formed on one side of the base material 1 at both edges along the longitudinal direction thereof, and a nonadhesive resin part 3 formed between the adhesive parts 2 and having substantially the same thickness as that of the adhesive parts 2. This cover tape is used to collectively pack chips and other small items while keeping them separate from each other to thereby permit the storage, transportation and automatic takeout thereof, which cover tape can be rendered very long. Further, the present invention provides a coating applicator suitable for use in the production of the above cover tape.

Abstract: An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable latent curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

Abstract: An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.

Abstract: An adhesive tape comprising an energy beam transmittable base sheet having a surface tension of not more than 40 dyne/cm and an adhesive layer formed on one surface of the base sheet, the adhesive layer comprising a (meth)acrylate polymer, an epoxy resin, a photopolymerizable low molecular weight compound, a heat activatable potential curing agent for the epoxy resin and a photopolymerization initiator for the photopolymerizable low molecular weight compound. The adhesive in the adhesive layer is curable with an energy beam and the so cured adhesive develops tackiness again when heated. When the tape is used in processing a semiconductor wafer, it serves as a dicing tape for holding the wafer in position during the dicing step. Each piece of the diced and cured adhesive layer, that is attached to each chip and capable of being tackified by heating, provides an adhesive required for securely mounting the chip on the lead frame in the die-bonding step.