Abstract: A thin film layered member having high heat dissipation efficiency is composed of at least two diamond layers and at least one interlayer. The diamond layers and the interlayer ape alternately laminated and the diamond layers form outer surfaces of the thin film layered member. When this member is applied to a heatsink or the like, thermal stress to an element mounted thereon can be reduced because of a laminated structure comprising an interlayer having a high coefficient of thermal expansion and diamond layers having a low coefficient of thermal expansion. Further, the interlayer includes a carbide forming metal, which reacts with carbon atoms constituting a diamond in a laminating process and to form a carbide at an interface between the interlayer and the diamond layer, thereby realizing strong bonding therebetween.