Abstract: A switch device includes a box-shaped case, a harness portion, and a fixing member. The harness portion is connected to a switch contact point and includes a plurality of lead lines extending out of the case. The case includes a holding body and a guide portion. The holding body includes a fixing portion protruding from an outer face of the case and provided on a tip side, and a through-hole provided under the fixing portion. The guide portion is opposed to the through-hole and formed in a substantially concave curve shape. The guide portion is formed such that an end portion further from the through-hole is positioned to be above an end portion closer to the through-hole. The fixing member extends through the through-hole and fixes the harness portion to the holding body by winding the harness portion and the fixing portion together.

Abstract: A switch device includes a box-shaped case, a harness portion, and a fixing member. The harness portion is connected to a switch contact point and includes a plurality of lead lines extending out of the case. The case includes a holding body and a guide portion. The holding body includes a fixing portion protruding from an outer face of the case and provided on a tip side, and a through-hole provided under the fixing portion. The guide portion is opposed to the through-hole and formed in a substantially concave curve shape. The guide portion is formed such that an end portion further from the through-hole is positioned to be above an end portion closer to the through-hole. The fixing member extends through the through-hole and fixes the harness portion to the holding body by winding the harness portion and the fixing portion together.

Abstract: The invention presents a manufacturing method of laminated substrate capable of realizing small size of portable electronic appliances. Prepreg 141 is a thermosetting resin which holds a plate form in first temperature range, has a thermal fluidity in second temperature range, and is cured in third temperature range, and integrating process (118) includes softening (120) of heating prepreg (141) to second temperature range, and softening the resin impregnated in prepreg (141), forced flowing (122) of compressing prepreg (141) before prepreg (141) comes to third temperature range, and forcing the resin to flow into space and gap formed among semiconductor (105), resistor (106), and substrate (101), and hardening (123) of heating prepreg (141) to third temperature range. As a result, without using intermediate material, space and gap formed among semiconductor (105), resistor (106), and substrate (101) can be securely filled with resin.

Abstract: A composite magnetic body is obtained without the use of halogen-based or halogen-containing materials, such as, halogen-based binding agent of halogen-based resins or elastomers, and bromine-based fire retardents. The composite magnetic body (1) comprises a soft magnetic powder (2) and a silicone rubber (3). The silicone rubber (3) should preferably be a solid silicone rubber. An electromagnet interference suppressing body is obtained using this composite magnetic body.