Abstract: A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconductor wafer or chip due to exothermic heat of the laser impression.

Abstract: A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconductor wafer or chip due to exothermic heat of the laser impression.

Abstract: A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconductor wafer or chip due to exothermic heat of the laser impression.

Abstract: A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconductor wafer or chip due to exothermic heat of the laser impression.

Abstract: A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconductor wafer or chip due to exothermic heat of the laser impression.

Abstract: According to the present invention, a semiconductor testing method includes the steps of: permitting an ATE processing unit of a reference ATE (Automatic LSI Test Equipment) to accumulate and form summary data of some of the total amount of manufactured semiconductor devices of one lot; permitting the reference ATE to transmit the formed summary data to a host computer through a communication line; permitting the host computer to store the summary data in a recording unit; permitting a determination unit to read the summary data stored in the recording unit; permitting the determination unit to read a quality control reference value; permitting the determination unit to compare and determine the read summary data and the quality control reference value to determine a test item to be edited; permitting an edit unit to edit a test program including the test item to be edited on the basis of the determination by the determination unit; permitting a transmission/reception unit of the host computer to install the

Abstract: A low thermal conductivity layer is formed on a back surface of a semiconductor wafer or chip, and a laser impression is formed on the low thermal conductivity layer. The laser impression can be formed without damaging the device surface of the semiconductor wafer or chip due to exothermic heat of the laser impression.