Patents by Inventor Mikio SUYAMA

Mikio SUYAMA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic component package and electronic component device
    Patent number: 10535972
    Abstract: An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: January 14, 2020
    Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., NICHIA CORPORATION
    Inventors: Shigeru Matsushita, Mikio Suyama, Eiichiro Okahisa, Kazuma Kozuru
  • ELECTRONIC COMPONENT PACKAGE AND ELECTRONIC COMPONENT DEVICE
    Publication number: 20190052042
    Abstract: An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.
    Type: Application
    Filed: August 6, 2018
    Publication date: February 14, 2019
    Inventors: Shigeru Matsushita, Mikio Suyama, Eiichiro Okahisa, Kazuma Kozuru
  • Optical semiconductor element package and optical semiconductor device
    Patent number: 9106047
    Abstract: An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.
    Type: Grant
    Filed: April 30, 2012
    Date of Patent: August 11, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yasuyuki Kimura, Mikio Suyama, Misuzu Machii
  • OPTICAL SEMICONDUCTOR ELEMENT PACKAGE AND OPTICAL SEMICONDUCTOR DEVICE
    Publication number: 20120287955
    Abstract: An optical semiconductor element package, includes a ceramic wiring substrate portion having a mounting area for mounting an optical semiconductor element in a center part, and including an element electrode for connecting the optical semiconductor element, and an external connection electrode connected to the element electrode, and a metal sealing ring provided on the ceramic wiring substrate portion, and including an opening portion exposing the element electrode and the mounting area, in a center part, and a ring-like protruding portion provided to an outer peripheral part of the opening portion.
    Type: Application
    Filed: April 30, 2012
    Publication date: November 15, 2012
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Yasuyuki KIMURA, Mikio SUYAMA, Misuzu MACHII