Patents by Inventor Mikio Yamagiwa

Mikio Yamagiwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multilayered wiring board and method for fabricating the same
    Patent number: 9040836
    Abstract: In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
    Type: Grant
    Filed: May 29, 2012
    Date of Patent: May 26, 2015
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Junichi Nakamura, Yuji Kobayashi, Mikio Yamagiwa
  • MULTILAYERED WIRING BOARD AND METHOD FOR FABRICATING THE SAME
    Publication number: 20120293973
    Abstract: In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
    Type: Application
    Filed: May 29, 2012
    Publication date: November 22, 2012
    Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventors: Junichi NAKAMURA, Yuji Kobayashi, Mikio Yamagiwa
  • Multilayered wiring board and method for fabricating the same
    Patent number: 8222527
    Abstract: In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
    Type: Grant
    Filed: August 25, 2006
    Date of Patent: July 17, 2012
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Junichi Nakamura, Yuji Kobayashi, Mikio Yamagiwa
  • Multilayered wiring board and method for fabricating the same
    Publication number: 20070119619
    Abstract: In a multilayered wiring board constituted by laminating to form pluralities of layers of wiring layers 105, 108, 110 and insulating layers 104, 106, 107, in the plurality of laminated insulating layers 104, 106, 107, the insulating layer 106 disposed at a laminating center in a laminating direction is made to constitute an insulating layer with a reinforcing member including a reinforcing member.
    Type: Application
    Filed: August 25, 2006
    Publication date: May 31, 2007
    Inventors: Junichi Nakamura, Yuji Kobayashi, Mikio Yamagiwa