Patents by Inventor Mikiyoshi Kawamura

Mikiyoshi Kawamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light-emitting device manufacturing method and light-emitting device
    Patent number: 7795053
    Abstract: A method for producing a light-emitting device comprising: a step of electrically connecting a first electrode provided on one main surface of a semiconductor substrate (element substrate) through a light-emitting layer, and a first lead of a lead frame, so as to oppose each other; a step of electrically connecting a second electrode provided on the rear surface of a surface provided with the light-emitting layer of said element substrate, and a second lead of the above-described lead frame; a step of encapsulating a connecting part of said first electrode and said first lead, and said second electrode, and an electrode part of the second lead, with a transparent resin; and a step of producing a discrete edge by cutting said first lead and the second lead from said lead frame; wherein a film of joining material (joining material film) made of an alloy or a single metal, is formed on the first electrode of said light-emitting element, and a pattern to reduce spreading of said joining material is formed on an e
    Type: Grant
    Filed: March 24, 2004
    Date of Patent: September 14, 2010
    Assignees: Hitachi Cable Precision Co., Ltd, Stanley Electric Co., Ltd.
    Inventors: Eiji Ohno, Syoichi Takahashi, Mikiyoshi Kawamura, Minoru Yamamura, Tadashi Tamaki, Hayato Oba, Masataka Kagiwada, Hiroyuki Takayama, Kei Teramura, Atsushi Ohtaka, Toshiaki Morikawa
  • Light-Emitting Device Manufacturing Method and Light-Emitting Device
    Publication number: 20070278511
    Abstract: A method for producing a light-emitting device comprising: a step of electrically connecting a first electrode provided on one main surface of a semiconductor substrate (element substrate) through a light-emitting layer, and a first lead of a lead frame, so as to oppose each other; a step of electrically connecting a second electrode provided on the rear surface of a surface provided with the light-emitting layer of said element substrate, and a second lead of the above-described lead frame; a step of encapsulating a connecting part of said first electrode and said first lead, and said second electrode, and an electrode part of the second lead, with a transparent resin; and a step of producing a discrete edge by cutting said first lead and the second lead from said lead frame; wherein a film of joining material (joining material film) made of an alloy or a single metal, is formed on the first electrode of said light-emitting element, and a pattern to reduce spreading of said joining material is formed on an e
    Type: Application
    Filed: March 24, 2004
    Publication date: December 6, 2007
    Inventors: Ejiji Ohno, Syoichi Takahashi, Mikiyoshi Kawamura, Minoru Yamamura, Tadashi Tamaki, Hayato Oba, Masataka Kagiwada, Hiroyuki Takayama, Kei Teramura, Atsushi Ohtaka, Toshiaki Morikawa