Patents by Inventor Mikko Antero Makinen

Mikko Antero Makinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11573055
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: February 7, 2023
    Assignee: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur
  • Patent number: 10932393
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.
    Type: Grant
    Filed: March 30, 2019
    Date of Patent: February 23, 2021
    Assignee: Intel Corporation
    Inventors: Juha Tapani Paavola, Mikko Antero Makinen, Columbia Mishra, Mark Carbone
  • Publication number: 20200132391
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur
  • Publication number: 20200029449
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a flexible display, a hinge, and a chassis. The flexible display has a display length and the chassis has a chassis length that is about the same length as the display length when the electronic device is relativity flat. In some examples, the chassis includes a flexible display support coupled to the flexible display and one or more slide mechanisms to accommodate the change in position of the chassis relatively to the flexible display when the electronic device is bent. In other examples, the hinge includes one or more chassis coupling tabs and the one or more chassis coupling tabs can accommodate the change in position of the chassis relatively to the flexible display when the electronic device is bent.
    Type: Application
    Filed: September 27, 2019
    Publication date: January 23, 2020
    Applicant: Intel Corporation
    Inventors: Mikko Antero Makinen, Gustavo Fricke, Juha Tapani Paavola, Christopher M. Moore
  • Publication number: 20190254194
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a torsional heat pipe. The torsional heat pipe can include a first housing static portion located in a first housing of an electronic device, where the first housing static portion is coupled to a heat source, a second housing static portion located in a second housing of the electronic device, where the second housing static portion is coupled to a heat spreader, and a torsion portion located in a hinge of the electronic device, where the hinge rotatably couples the first housing to the second housing and the torsion portion rotates as the second housing rotates relative to the first housing and the torsion portion couples the first housing static portion to the second housing static portion.
    Type: Application
    Filed: March 30, 2019
    Publication date: August 15, 2019
    Applicant: Intel Corporation
    Inventors: Juha Tapani Paavola, Mikko Antero Makinen, Columbia Mishra, Mark Carbone