Patents by Inventor Mikko Heikkinen
Mikko Heikkinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11956293Abstract: Systems and methods for the selection of a network interface/CDN pair from among multiple network interface/CDN pairs are provided. In an embodiment, a method includes retrieving information about sets of CDNs accessible via different network interfaces of a device. A plurality of network interface/CDN pairs are then identified, and performance metrics for each pair are measured. A best pair is selected, and is used to retrieve the next segments of a requested content item.Type: GrantFiled: March 29, 2023Date of Patent: April 9, 2024Assignee: Adeia Guides Inc.Inventors: Antti Heikkinen, Mikko Uitto
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Patent number: 11950367Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: GrantFiled: July 17, 2023Date of Patent: April 2, 2024Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Pälvi Apilo, Mikko Heikkinen, Topi Wuori, Mikko Sippari, Heikki Alamäki
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Patent number: 11936710Abstract: A sidelink connection is created between each device of a plurality of devices. A first device connected to a content source retrieves a manifest file for the media from the content source. The first device then notifies other devices, including a second device not connected to the content source, that the manifest file is available from the first device. Based on connection metrics of each device, it is determined which of the devices has the highest quality connection to the content source. If, for example, the first device is determined to have the highest quality connection, then the first devices retrieves a segment of the media from the content source, stores the segment in a cache of the first device, and delivers the segment to other devices in response to requests for the segment received from each device.Type: GrantFiled: August 30, 2022Date of Patent: March 19, 2024Assignee: Rovi Guides, Inc.Inventors: Antti Heikkinen, Mikko Uitto
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Patent number: 11934004Abstract: An electronic device includes a substrate film having a first side and a second side, and a number of light sources configured to emit light. A plastic lightguide layer is molded onto the first side of the substrate film. The plastic lightguide layer being of optically at least translucent material to transmit light. The device also includes a masking layer provided on the outer surface of the plastic lightguide layer. The masking layer defines a window for letting the light emitted by the embedded light sources to pass through the masking layer towards the environment.Type: GrantFiled: February 18, 2022Date of Patent: March 19, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Mikko Heikkinen
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Patent number: 11936711Abstract: A sidelink connection is created between each device of a plurality of devices. If the sidelink connection quality is not sufficient to transmit a first version of a segment encoded at a first quality level, a lower quality version of the segment may also be retrieved. The lower quality version of the segment may be retrieved by a different device than the device that retrieved the first version of the segment. If the segment is requested from a first device by a second device and the sidelink connection between the first device and the second device is not sufficient to transmit the first version of the segment, the first device may cause transmission of the lower quality version of the segment retrieved by a third device to the second device.Type: GrantFiled: August 30, 2022Date of Patent: March 19, 2024Assignee: Rovi Guides, Inc.Inventors: Antti Heikkinen, Mikko Uitto
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Publication number: 20240073271Abstract: A sidelink connection is created between each device of a plurality of devices. A first device connected to a content source retrieves a manifest file for the media from the content source. The first device then notifies other devices, including a second device not connected to the content source, that the manifest file is available from the first device. Based on connection metrics of each device, it is determined which of the devices has the highest quality connection to the content source. If, for example, the first device is determined to have the highest quality connection, then the first devices retrieves a segment of the media from the content source, stores the segment in a cache of the first device, and delivers the segment to other devices in response to requests for the segment received from each device.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Inventors: Antti Heikkinen, Mikko Uitto
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Publication number: 20240073272Abstract: A sidelink connection is created between each device of a plurality of devices. If the sidelink connection quality is not sufficient to transmit a first version of a segment encoded at a first quality level, a lower quality version of the segment may also be retrieved. The lower quality version of the segment may be retrieved by a different device than the device that retrieved the first version of the segment. If the segment is requested from a first device by a second device and the sidelink connection between the first device and the second device is not sufficient to transmit the first version of the segment, the first device may cause transmission of the lower quality version of the segment retrieved by a third device to the second device.Type: ApplicationFiled: August 30, 2022Publication date: February 29, 2024Inventors: Antti Heikkinen, Mikko Uitto
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Patent number: 11914184Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: June 22, 2023Date of Patent: February 27, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11906774Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: May 31, 2023Date of Patent: February 20, 2024Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Patent number: 11910530Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: GrantFiled: March 25, 2022Date of Patent: February 20, 2024Assignee: TACTOTEK OYInventors: Vinski Bräysy, Ilpo Hänninen, Pälvi Apilo, Mikko Heikkinen, Topi Wuori, Mikko Sippari, Heikki Alamäki
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Publication number: 20240021764Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: September 28, 2023Publication date: January 18, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240004120Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective laver towards the plastic layer.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240004119Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source, the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: ApplicationFiled: May 31, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20240003516Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: ApplicationFiled: June 22, 2023Publication date: January 4, 2024Inventors: Antti KERÄNEN, Sami TORVINEN, Tero HEIKKINEN, Pasi KORHONEN, Pälvi APILO, Mikko HEIKKINEN, Jarmo SÄÄSKI, Paavo NISKALA, Ville WALLENIUS, Heikki TUOVINEN, Janne ASIKKALA, Taneli SALMI, Suvi KELA, Outi RUSANEN, Johanna JUVANI, Mikko SIPPARI, Tomi SIMULA, Tapio RAUTIO, Samuli YRJÄNÄ, Tero RAJANIEMI, Simo KOIVIKKO, Juha-Matti HINTIKKA, Hasse SINIVAARA, Vinski BRÄYSY, Olimpia MIGLIORE, Juha SEPPONEN
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Publication number: 20230389184Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate, and arranging electrically conductive joint material onto the first and the second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: ApplicationFiled: July 17, 2023Publication date: November 30, 2023Inventors: Vinski BRÄYSY, Ilpo HÄNNINEN, Pälvi APILO, Mikko HEIKKINEN, Topi WUORI, Mikko SIPPARI, Heikki ALAMÄKI
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Patent number: 11817534Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors preferably additively printed on the substrate film; a light source provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception; an optically transmissive plastic layer produced upon the first side of the substrate film, said plastic layer at least laterally surrounding, the light source, the substrate film at least having a similar or lower refractive index therewith; and a reflector design comprising at least one material layer, said reflector design being configured to reflect, the light emitted by the light source and incident upon the reflector design.Type: GrantFiled: July 2, 2022Date of Patent: November 14, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Sami Torvinen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Publication number: 20230309231Abstract: A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.Type: ApplicationFiled: March 25, 2022Publication date: September 28, 2023Inventors: Vinski BRÄYSY, Ilpo HÄNNINEN, Pälvi APILO, Mikko HEIKKINEN, Topi WUORI, Mikko SIPPARI, Heikki ALAMÄKI
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Patent number: 11703627Abstract: An integrated optically functional multilayer structure includes a flexible, substrate film arranged with a circuit design including at least a number of electrical conductors on the substrate film; and a plurality of top-emitting, bottom-installed light sources provided upon a first side of the substrate film to internally illuminate at least portion of the structure for external perception via associated outcoupling areas, wherein for each light source of the plurality of light sources there is optically transmissive plastic layer, produced upon the first side of the substrate film, said plastic layer at least laterally surrounding the light source; the substrate film at least having a similar or lower refractive index therewith; and reflector design including at least one material layer, provided at least upon the light source and configured to reflect the light emitted by the light source and incident upon the reflective layer towards the plastic layer.Type: GrantFiled: September 15, 2022Date of Patent: July 18, 2023Assignee: TACTOTEK OYInventors: Antti Keränen, Tero Heikkinen, Pasi Korhonen, Pälvi Apilo, Mikko Heikkinen, Jarmo Sääski, Paavo Niskala, Ville Wallenius, Heikki Tuovinen, Janne Asikkala, Taneli Salmi, Suvi Kela, Outi Rusanen, Johanna Juvani, Mikko Sippari, Tomi Simula, Tapio Rautio, Samuli Yrjänä, Tero Rajaniemi, Simo Koivikko, Juha-Matti Hintikka, Hasse Sinivaara, Vinski Bräysy, Olimpia Migliore, Juha Sepponen
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Publication number: 20230066507Abstract: An apparatus, method and computer program is described comprising: capturing images using one or more imaging devices of a foldable user device, wherein the user device comprises a visual display, wherein, in a first mode of operation, a display output on the visual display is modified depending on a folding angle of the foldable user device; capturing audio using one or more microphones of the foldable user device; providing a wind mode indication in a second mode of operation; and disabling the modification of the visual display depending on the folding angle in the second mode of operation.Type: ApplicationFiled: December 10, 2020Publication date: March 2, 2023Inventors: Jussi LEPPÄNEN, Arto LEHTINIEMI, Antti ERONEN, Mikko HEIKKINEN
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Patent number: 11594482Abstract: An integrated multilayer structure, includes a substrate film having a first side and an opposite second side. The substrate film includes electrically substantially insulating material, a circuit design including a number of electrically conductive areas of electrically conductive material on the first and/or second sides of the substrate film, and a connector including a number of electrically conductive contact elements. The connector is provided to the substrate film so that it extends to both the first and second sides of the substrate film and the number of electrically conductive contact elements connect to one or more of the conductive areas of the circuit design while being further configured to electrically couple to an external connecting element responsive to mating the external connecting element with the connector on the first or second side of or adjacent to the substrate film.Type: GrantFiled: July 6, 2021Date of Patent: February 28, 2023Assignee: TACTOTEK OYInventors: Jarmo Sääski, Mikko Heikkinen, Tero Heikkinen, Mika Paani, Jan Tillonen, Ronald Haag