Abstract: A multilayer structure includes a flexible substrate film having a first side and opposite second side, a number of conductive traces, optionally defining contact pads and/or conductors, printed on the first side for establishing a desired predetermined circuit design, a plastic layer molded onto the first side so as to enclose the circuit between the plastic layer and the first side, and a connector in a form of a flexible flap for providing external electrical connection to the embedded circuit from the second, opposite side, the connector defined by a portion of the substrate film accommodating at least part of one or more of the printed conductive traces and cut partially loose from the surrounding substrate material to establish the flap, whose loose end is bendable away from the molded plastic layer to facilitate establishment of the electrical connection with external element, wire or connector, via the associated gap.

Abstract: A multilayer structure for an electronic device having a flexible substrate film (202) for accommodating electronics (204); at least one electronic component (204) provided on said substrate film (202); and a number of conductive traces (206) provided on said substrate film (202) for electrically powering and/or connecting electronics including said at least one electronic component (204), wherein at least one preferably thermoformed cover (210) is attached to said substrate film (202) on top of said at least one electronic component (204), the at least one thermoformed cover (210) and the substrate film (202) accommodating the electronics (204) being overmolded with thermoplastic material (208).

Abstract: Method for manufacturing an electromechanical structure, com-prising: producing conductors and/or graphics on a substantially flat film 106, attaching electronic elements on the said film 108 in relation to the de-sired three-dimensional shape of the film, forming the said film housing the electronic elements into a substantially three-dimensional shape 110, using the substantially three-dimensional film as an insert in an injection molding process by molding substantially on said film 112, wherein a preferred layer of material is attached on the surface of the film, creating an electromechanical structure. A corresponding arrangement for carrying out said method is also presented.

Abstract: A multilayer structure for an electronic device, includes a flexible substrate film (202, 502) for accommodating electronics, a number of electronic components (308, 508) provided on a first surface area (401A, 501A) of the film, the film also including a second surface area adjacent (401B, 501B) to the first surface area, and a number of conductive traces (412, 512) printed on the substrate film for electrically connecting electronic components together, wherein the number of electronic components and the related first surface area of the substrate accommodating the components have been overmolded with first thermoplastic material (306, 506), the adjacent second surface area and at least part of the first area being overmolded with second thermoplastic material so that at least part of the electronic components and the first thermoplastic material thereon are substantially embedded between the substrate film and second thermoplastic material. A corresponding method of manufacture is presented.

Abstract: A multilayer structure for a garment, optionally footwear, includes a flexible substrate film for accommodating electronics, a number of flexible sensor pads provided on the film utilizing printed electronics technology, optionally screen printing or ink jetting, at least one electronic circuit, preferably integrated circuit, further provided on the film for controlling capacitive measurements via the number of sensor pads for obtaining an indication of pressure subjected to the multilayer structure, a number of conductor traces further printed on the film for electrically connecting the at least one electronic circuit and the number of capacitive sensor pads, a power supply element for powering electricity-driven components including the at least one electronic circuit, and at least one plastic layer molded upon the film substantially embedding the number of sensor pads, conductor traces and the at least one electronic circuit therewithin. A related method of manufacture is presented.

Abstract: A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

Abstract: Multilayer structure (200) for electronic devices, including a flexible substrate film (102) for accommodating electronics, a number of electrical elements (204, 206) provided to the flexible substrate film, preferably by element of printed electronics and/or surface mounting, a protective layer (104) laminated onto at least first surface of the substrate film, the protective layer being configured to mask perceivable physical deviation of the substrate, such as uneven surface profile or coloring, substantially at the location of the number of elements, from outside perception, optionally visual perception and/or tactile inspection taking place via the protective layer, and plastic layer (106) molded over at least second surface of the substrate film opposite to the first surface. A corresponding method of manufacture is presented.

Abstract: A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

Abstract: A method for manufacturing an electronic product, comprising providing a flexible, optionally optically substantially transparent or translucent, substrate film, printing a number of conductive traces of conductive ink on the substrate film, said traces defining a number of conductors and conductive contact areas for the contacts of at least one electronic surface-mountable component, disposing the at least one electronic surface-mountable component, such as an integrated circuit, on the substrate film so that the contacts meet the predefined contact areas when they are still wet to establish the electrical connection therebetween, and further securing, optionally overmoulding, the component. Related arrangement and electronic product are presented.

Abstract: A composite laminate assembly for an electronic device provides integrated backlighting for one or more indicator shapes defined by the assembly. The assembly includes a substantially opaque cover member to obscure at least parts of the electronic device. Translucent indicator structures in the cover member define respective indicator shapes to allow backlighting to pass through the cover member. An optical matrix layer of an optically conductive material is attached to an inner face of the cover member, with a plurality of lighting devices embedded in the optical matrix layer and laterally offset from associated indicator structures. The plurality of lighting devices may be connected to an electric circuit carried on the inner face of the cover member.

Abstract: Systems and methods applicable, for instance, in gaming. Functionality might, for instance, be provided wherein one or more users are, in the context of a video game, presented with one or more real-world fitness tasks to be performed. Various monitoring operations might, for example, be performed. Various compensatory operations might, for example, be performed. Such compensatory operations might, for instance, take into account user fitness levels and/or environments in which real-world fitness tasks are performed.

Abstract: An electronic device for visualizing data and receiving related gesture-based control input from a user, configured to obtain digital image data utilizing a number of camera entities and to derive the control input on the basis of the image data, the electronic device including a display panel for displaying data to a user, and at least one protective element integrated with the display panel and including, as disposed at the periphery region around the active area of the display panel, the number of camera entities substantially embedded therein, the protective element including material that is optically substantially transparent relative to the predetermined reception wavelengths of the optically sensitive areas of the camera entities and substantially covers the sensitive areas, the camera entities in the protective element to span at least partially overlapping fields of view substantially in front of the display panel. A corresponding method of manufacture is presented.

Abstract: A method and a system for forming one or more integrated light guides comprising one or more light sources and one or more light transmissive materials are disclosed. At least one of the one or more light transmissive materials is capable of transmitting light emitted by at least one of the one or more light sources. The method includes disposing the one or more light sources on one or more sides of a substrate to form an arrangement of the one or more light sources. Additionally, the method includes molding the one or more light transmissive materials onto one or more parts of one or more sides of the arrangement of the one or more light sources to form the one or more integrated light guides.

Abstract: Systems and methods applicable, for instance, in gaming. Functionality might, for instance, be provided wherein one or more users are, in the context of a video game, presented with one or more real-world fitness tasks to be performed. Various monitoring operations might, for example, be performed. Various compensatory operations might, for example, be performed. Such compensatory operations might, for instance, take into account user fitness levels and/or environments in which real-world fitness tasks are performed.

Abstract: The present invention relates to an operation method for executing games on mobile camera enabled terminal devices and to devices capable of executing the method. The method is based on hiding augmented reality messages in pictures by taking an image of an object, providing symbols; linking the symbols to the image, such that the symbols are not visible when displaying the image, and sending the image and the linked invisible symbols via a wireless connection as a first image to a mobile camera terminal device. The invention also provides a second component to re-visualize the hidden message by receiving the first image, taking a second image with a camera of the mobile camera terminal device, displaying the second image, comparing the first and second images to determine a matching measure, and visibly displaying the linked invisible symbols on the display, if the comparison fulfills at least one predetermined condition.