Patents by Inventor Mikko Makinen

Mikko Makinen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250254848
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: April 21, 2025
    Publication date: August 7, 2025
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Publication number: 20250153902
    Abstract: The invention relates to drinking cups comprising a sidewall that is composed of a multilayer cardboard comprising one or more crosslinked polysiloxane layers [A]; a pigment coating or barrier coating layer [B]; a fiber based substrate layer [C]; optionally, a pigment coating layer [D]; a printed layer [E] comprising a printed image and/or decoration; and optionally, one or more crosslinked polysiloxane layers [F]. The multilayer cardboard preferably has a Cobb 600 value determined according to EN ISO 535 of at least 0.2 g·m2. Preferably, the multilayer cardboard has a total content of polyolefins of at most 5.0 wt.-%, relative to the total weight of the multilayer cardboard.
    Type: Application
    Filed: February 14, 2023
    Publication date: May 15, 2025
    Inventors: Mikko MÄKINEN, Harald KUIPER
  • Patent number: 12284793
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: April 22, 2025
    Assignee: Intel Corporation
    Inventors: Ritu Bawa, Ruander Cardenas, Kathiravan D, Jia Yan Go, Chin Kung Goh, Jeff Ku, Prakash Kurma Raju, Baomin Liu, Twan Sing Loo, Mikko Makinen, Columbia Mishra, Juha Paavola, Prasanna Pichumani, Daniel Ragland, Kannan Raja, Khal Ern See, Javed Shaikh, Gokul Subramaniam, George Baoci Sun, Xiyong Tian, Hua Yang, Mark Carbone, Vivek Paranjape, Nehakausar Pinjari, Hari Shanker Thakur, Christopher Moore, Gustavo Fricke, Justin Huttula, Gavin Sung, Sammi Wy Liu, Arnab Sen, Chun-Ting Liu, Jason Y. Jiang, Gerry Juan, Shih Wei Nien, Lance Lin, Evan Kuklinski
  • Publication number: 20240416335
    Abstract: Multichannel pipettes, electroporation systems utilizing the multichannel pipettes and methods for electroporating a cell. The electroporation system includes a multichannel pipette, a pipette tip(s), a pipette docking assembly, and a pulse generator. The pipette docking assembly includes a pipette station, a pipette station guard, and a reservoir.
    Type: Application
    Filed: June 10, 2024
    Publication date: December 19, 2024
    Inventors: Wui Khen Kevin LIAW, Kuan Moon Boo, Huei Steven YEO, Wern Yuh FOO, Joshua Mathew MEAD, Justina Linkai BONG, Mikko MAKINEN, Mio Xiu Lu LING, Way Xuang LEE, Wen Lun CHAN, Yunxiang LIU
  • Publication number: 20240150699
    Abstract: An electroporation system including one or more of a pipette, a pipette tip, a pipette docking assembly, and a pulse generator. The pipette docking assembly includes a pipette station, a pipette station guard, and a reservoir (e.g., a buffer tube). A method for transfecting a cell with a payload including providing an electroporation system, providing the cell, providing the payload, introducing the cell and the payload into a pipette tip, and electroporating the cell within the pipette tip by operating the electroporation system.
    Type: Application
    Filed: September 15, 2023
    Publication date: May 9, 2024
    Inventors: Han WEI, Chee Wai CHAN, Wui Khen LIAW, Shan Hua DONG, See Chen GOH, Huei Steven YEO, Harmon Cosme SICAT, JR., Mio Xiu Lu LING, Josh M. MEAD, Mikko MAKINEN, Beng Heng LIM, Kuan Moon BOO, Justina Linkai BONG, Chye Sin NG, Wee Liam LIM, Li Yang LIM, Way Xuang LEE
  • Patent number: 11930610
    Abstract: Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.
    Type: Grant
    Filed: December 6, 2021
    Date of Patent: March 12, 2024
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Juha Paavola, Mark Carbone, Shantanu Kulkarni, Mikko Makinen, Gustavo Fricke
  • Patent number: 11870088
    Abstract: The present disclosure is directed to systems and methods for improving the rigidity or stiffness of an electronic device chassis or housing using a structural secondary battery. The structural secondary battery includes a compression skin disposed about one or more secondary storage cells. The compression skin exerts a compressive force of at least 0.5 atmospheres on the one or more secondary storage cells. A structural member is bonded to the compression skin. The structural member includes a relatively thin (e.g. 0.1 mm or less), rigid (e.g., Young's Modulus of at least 300 GPa), member, such as a sapphire crystal. The structural member may then be bonded or otherwise detachably or non-detachably affixed to an aperture formed in the electronic device chassis or housing. The bonding of the structural member to the electronic device chassis or housing beneficially improves the stiffness of the chassis or housing.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: January 9, 2024
    Assignee: Intel Corporation
    Inventors: Juha Paavola, Naoki Matsumura, Mikko Makinen
  • Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Publication number: 20220095468
    Abstract: Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.
    Type: Application
    Filed: December 6, 2021
    Publication date: March 24, 2022
    Inventors: Jeff Ku, Juha Paavola, Mark Carbone, Shantanu Kulkarni, Mikko Makinen, Gustavo Fricke
  • Patent number: 11277929
    Abstract: Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: March 15, 2022
    Assignee: INTEL CORPORATION
    Inventors: Jeff Ku, Juha Paavola, Mark Carbone, Shantanu Kulkarni, Mikko Makinen, Gustavo Fricke
  • Publication number: 20210311529
    Abstract: Apparatus, systems, articles of manufacture, and methods have been disclosed that include example hinges to couple a first screen and a second screen of an electronic device. An example apparatus includes a first gear rotatable about a first axis of rotation, a second gear rotatable about a second axis of rotation, and a link gear rotatably coupled to the first gear and rotatably coupled to the second gear.
    Type: Application
    Filed: November 3, 2020
    Publication date: October 7, 2021
    Inventors: Mikko Makinen, Gustavo Fricke
  • Publication number: 20210043964
    Abstract: Li-metal battery with a pressure chamber to allow uniform pressure on a battery. The pressure chamber is supported by metal plates (such as pressure equalization plate) used to give uniform pressure to the battery. The pressure chamber may include pressured gas, elastic material, spring plate, etc. The outer skin of the pressure chamber is free to bow, restrained at its edges by (metal) skin, but still exerts a uniform pressure on the plate that is compressing the battery cell. The pressure chamber gives uniform pressure to battery, which is used to enable high-energy density battery with, for example, 20% more battery life.
    Type: Application
    Filed: July 30, 2020
    Publication date: February 11, 2021
    Applicant: Intel Corporation
    Inventors: Naoki Matsumura, Juha Paavola, Mikko Makinen, Vivek Paranjape, Andy Keates
  • Patent number: 10852779
    Abstract: Apparatus, systems, articles of manufacture, and methods have been disclosed that include example hinges that enable a physical keyboard to be stowed between halves of a closed electronic device with dual screens. An example device includes a first screen, a second screen, a first hinge pair, and a second hinge pair. The first hinge pair and the second hinge pair enable 360 degrees of rotation between the first screen and the second screen. The device also includes a physical keyboard that is couplable to a plurality of positions on at least one of the first screen or the second screen.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: December 1, 2020
    Assignee: Intel Corporation
    Inventors: Mikko Makinen, Gustavo Fricke
  • Patent number: D914021
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: March 23, 2021
    Assignee: Intel Corporation
    Inventors: Aleksander Magi, Duck Young Kong, Mikko Makinen, Stan C. Woody
  • Patent number: D933058
    Type: Grant
    Filed: April 27, 2018
    Date of Patent: October 12, 2021
    Assignee: Intel Corporation
    Inventors: Mikko Makinen, Gustavo Fricke
  • Patent number: D964984
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: September 27, 2022
    Assignee: Intel Corporation
    Inventors: Mikko Makinen, Gustavo Fricke
  • Patent number: D987622
    Type: Grant
    Filed: March 25, 2020
    Date of Patent: May 30, 2023
    Assignee: Intel Corporation
    Inventors: Gustavo Fricke, Mikko Makinen, Rand Lenroot, Christopher M. Moore, Saara Kamppari-Miller, Edward Morton Burdick
  • Patent number: D1001797
    Type: Grant
    Filed: February 19, 2020
    Date of Patent: October 17, 2023
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Juha Paavola, Mark Carbone, Shantanu Kulkarni, Mikko Makinen, Gustavo Fricke
  • Patent number: D1033433
    Type: Grant
    Filed: February 23, 2021
    Date of Patent: July 2, 2024
    Assignee: Intel Corporation
    Inventors: Aleksander Magi, Duck Young Kong, Mikko Makinen, Stan C. Woody
  • Patent number: D1047998
    Type: Grant
    Filed: July 12, 2022
    Date of Patent: October 22, 2024
    Assignee: Intel Corporation
    Inventors: Mikko Makinen, Gustavo Fricke