Patents by Inventor Miko Huang

Miko Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7749781
    Abstract: A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.
    Type: Grant
    Filed: June 2, 2007
    Date of Patent: July 6, 2010
    Assignee: Harvatek Corporation
    Inventors: Bily Wang, Jonnie Chuang, Miko Huang
  • Publication number: 20080194048
    Abstract: A method for manufacturing a light-emitting diode having a high heat-dissipating efficiency forms a thickened metal into a plurality of supports. The support has a first electrode and a second electrode thereon. The first electrode is formed with a trough. The chip that emits a visible light or an invisible light is adhered in the trough. Then, two leads are welded on the chip. One end of each of the two leads is welded to the first and second electrodes respectively. Various glues are dotted on the chip, adhesive, leads and the support. Finally, the glue is formed into a seat and lens having a packaged chip, adhesive, leads and support by means of a hot press-forming process.
    Type: Application
    Filed: June 2, 2007
    Publication date: August 14, 2008
    Inventors: Bily WANG, Jonnie CHUANG, Miko HUANG
  • Publication number: 20080191235
    Abstract: A light emitting diode structure with a high heat dissipating effect includes a lead frame, a chip, two lead wires, an internal casing and an external casing. The lead frame has a first electrode and a second electrode, and the first electrode forms a cavity for installing the visible or invisible light chip in the cavity, and the chip is electrically coupled to two lead wires, and an end of the two lead wires is electrically and respectively coupled to the first and second electrodes, and the chip has an internal casing, and the two lead wires of the lead frame and the surface of the internal casing are wrapped by an external casing having a base and a lens.
    Type: Application
    Filed: June 2, 2007
    Publication date: August 14, 2008
    Inventors: Bily WANG, Jonnie Chuang, Miko Huang