Patents by Inventor Miku BRODIN-LAAKSO

Miku BRODIN-LAAKSO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD AND ARRANGEMENT FOR ASSEMBLY OF MICROCHIPS INTO A SEPARATE SUBSTRATE
    Publication number: 20220324703
    Abstract: Method and arrangement for assembling one or more microchips (415; 615; 715; 815; 915; 1015) into one or more holes (422; 722), respectively, in a substrate surface (421; 721) of a separate receiving substrate (420; 720; 820; 1020). The holes (422; 722) of the substrate is for microchip insertion out-of-plane in relation to said substrate surface. Each of said microchips is provided with a ferromagnetic layer (213; 613) of ferromagnetic material. The microchips are placed (503) on said substrate surface (421; 721) and it is applied and moved (504) one or more magnetic fields affecting said ferromagnetic layer (213; 613) of each microchip such that the microchips thereby become out-of-plane oriented in relation to said substrate surface (421; 721) and move over the substrate surface (421; 721) until assembled into said holes (422; 722).
    Type: Application
    Filed: September 10, 2020
    Publication date: October 13, 2022
    Inventors: Federico RIBET, Miku BRODIN-LAAKSO, Simone PAGLIANO, Frank NIKLAUS, Niclas ROXHED, Göran STEMME