Abstract: A power semiconductor module (1) is specified, comprising: at least one semiconductor chip (5) being connected to a cooling structure (3), at least two power terminals (7) being in electrical contact to the at least one semiconductor chip (5), and a housing (23) for the power semiconductor chip (5) and the at least two power terminals (7), wherein each of the at least two power terminals (7) has a protruding part (9) protruding beyond the housing (23) in lateral directions, and each of the at least two protruding parts (9) is provided with a first alignment hole (10). Further, a power semiconductor device and a method for producing a power semiconductor device is specified.

Abstract: A power semiconductor component with power semiconductor modules connected to a cooling structure, and a cooling chamber having an inlet and outlet port, and adapted for a flow direction of a coolant substance from the inlet port to the outlet port, each of the cooling structures provided within the cooling chamber consecutively in direction of the flow direction forming a flow resistance region in the cooling chamber, the cooling chamber comprises at least a bypass region connected in parallel to at least one of the at least two flow resistance regions being closer to the inlet port, and is adapted for a flow rate of the at least one flow resistance region, which is connected in parallel to the bypass region, closer to the inlet port being smaller than a flow rate of one of the at least two flow resistance regions closer to the outlet port.

Abstract: A base plate and power semiconductor module are provided, involving a basic body formed in one piece and having a front and rear side. The front side has a mounting area of the base plate. Along at least one of its edges, the basic body has at least one elevated integral part forming at least one sidewall projecting beyond the mounting area by a vertical height. At mounting area regions, the basic body has vertical thickness extending between the front and rear side and being larger than the vertical height of the sidewall. Along all edges, the basic body involves either at least one sidewall or at least one groove, but not both, at the same edge. Along at least one of its edges, the basic body involves one elevated integral part forming the at least one sidewall.

Abstract: A power module comprising at least one module component is provided. The power module has a side surface. The side surface of the power module comprises positioning structures. At least one of the positioning structures has a geometrical form configured for receiving an alignment tool and further configured for vertically moving the power module when sliding the alignment tool along a lateral direction. Moreover, an alignment tool and a method using the alignment tool for positioning and aligning the power module are provided.

Abstract: In one embodiment, a pre-product is configured for an electronic device intended to be loaded with a maximum current of at least 10 A, and comprises: an electronic component, a plurality of power terminals for external electrical contacting the electronic device, and a slide rail at an end of the at least one assigned power terminal remote from the electronic component. The power terminals are electrically connected to the electronic component and extend in a direction away from the electronic component. The slide rail is integrated in a metallic first leadframe together with at least one of the power terminals. A weight of the pre-product is at least 0.1 kg.

Abstract: A effective lower flow direction comprises power module and a housing that is arranged on an upper surface of the power module defining an upper flow section for liquid cooling of the power module in between. The upper flow section comprises an inlet, an outlet and a given upper flow path in between defining an effective upper flow direction. Further, a cooling unit is arranged on the lower surface of the power module defining a lower flow section for liquid cooling of the power module in between. The lower flow section comprises an inlet, an outlet and a given lower flow path in between defining an effective lower flow direction, such that during operation a coolant flows through the upper and the lower flow section providing a double-sided liquid cooling of the power module. The effective upper flow direction is different from the effective lower flow direction.

Abstract: In one embodiment, a power semiconductor module includes a main substrate, semiconductor chips mounted on the main substrate, and an auxiliary substrate also mounted on the main substrate. The power semiconductor module is capable of handling a current of 10 A or more. The auxiliary substrate is a printed circuit board having at least one carrier layer that is based on an organic material. The auxiliary substrate provides a common contact platform for at least some of the first semiconductor chips. The auxiliary substrate is attached to the main substrate by a joining layer located at a bottom side of the at least one auxiliary substrate facing the main substrate. The joining layer is a continuous organic adhesive layer of an adhesive foil or a double-faced adhesive tape.

Abstract: An apparatus includes a baseplate and a cooler providing a cooling channel adapted for providing a coolant flow. An electronic circuit includes a power semiconductor device disposed at the first side of baseplate. A footprint of the power semiconductor device defines a device area on the first side. A cooling area at the second side of the baseplate opposite the device area is adapted for dissipating heat from the baseplate by bringing the cooling area into thermal contact with the coolant flow in the cooling channel. An auxiliary area is located on the second side of the baseplate adjacent to the cooling area. The auxiliary area includes a flow guide for reducing a flow rate of the coolant flow in the auxiliary area and the cooling channel is adapted to receive the cooling area and the flow guide.

Abstract: A power semiconductor module includes an insulating substrate with a top metallization layer; a semiconductor chip bonded to the top metallization layer; and a terminal welded with a foot to the top metallization layer and electrically interconnected to the semiconductor chip. At least one of the top metallization layer and a bottom metallization layer of the substrate provided opposite to the top metallization layer comprises a plurality of dimples, which are distributed in a connection region below and/or around the welded foot.

Abstract: A power semiconductor module includes a baseplate that has a first region at a first side located adjacent to an edge of the baseplate and proceeding in a first plane. An encapsulation material covers portions of the baseplate so that the first region of the baseplate is free of the encapsulation material and the baseplate at the edge side adjacent to the first region is at least partly covered by the encapsulation material. The baseplate at its first side is configured for being provided with an electric circuit and the baseplate at its second side is configured for being brought into contact to a heat dissipating element by applying a clamping force with a clamping part to the first region.

Abstract: A power semiconductor module includes an insulating substrate with a top metallization layer; a semiconductor chip bonded to the top metallization layer; and a terminal welded with a foot to the top metallization layer and electrically interconnected to the semiconductor chip. At least one of the top metallization layer and a bottom metallization layer of the substrate provided opposite to the top metallization layer comprises a plurality of dimples, which are distributed in a connection region below and/or around the welded foot.

Abstract: A gas turbine membrane seal is disclosed. The gas turbine membrane seal includes a membrane, the membrane configured and arranged to extend from a first gas turbine component to a second gas turbine component and to separate two volumes, and an anti-fretting part configured and arranged to be attached to the first gas turbine component. A face of the anti-fretting part is adjacent to the membrane, and the face of the anti-fretting part is convex. Further embodiments of the gas turbine membrane seal are also described, along with a gas turbine having the gas turbine membrane seal and a retrofitting method.

Abstract: A gas turbine membrane seal is disclosed. The gas turbine membrane seal includes a membrane, the membrane configured and arranged to extend from a first gas turbine component to a second gas turbine component and to separate two volumes, and an anti-fretting part configured and arranged to be attached to the first gas turbine component. A face of the anti-fretting part is adjacent to the membrane, and the face of the anti-fretting part is convex. Further embodiments of the gas turbine membrane seal are also described, along with a gas turbine having the gas turbine membrane seal and a retrofitting method.