Abstract: A system for implementing operational process control servers includes an application server for receiving operational process control data from operational process control servers associated with components of the monitored process, a data visualization server for receiving the data from the application server and producing reports based on the data, and a server configuration user interface for facilitating specification of configuration parameters of the operational process control servers according to operational process control unified architecture standards.

Abstract: A system for implementing operational process control servers includes an application server for receiving operational process control data from operational process control servers associated with components of the monitored process, a data visualization server for receiving the data from the application server and producing reports based on the data, and a server configuration user interface for facilitating specification of configuration parameters of the operational process control servers according to operational process control unified architecture standards.

Abstract: A solder resist and a positively-acting photoresist are successively applied on a surface-wide basis onto a printed circuit board, whereupon the photoresist is selectively exposed and developed in the region of plated-through holes and/or solder pads of a printed conductor pattern carried on the printed circuit board, preferably with the assistance of laser beams. Subsequently, the solder resist is stripped in the regions not protected by the photoresist, i.e. in the regions of plated-through holes and/or solder pads and, as a last step, the remaining photoresist is likewise stripped. The method is particularly suited for the application of a solder resist layer onto three-dimensional printed circuit boards since traditional mask techniques for structuring the solder resist cannot be employed with respect to three-dimensional printed circuit boards.