Patents by Inventor Miles Dudman

Miles Dudman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8662886
    Abstract: The present invention relates generally to semiconductor wafer fabrication and more particularly but not exclusively to advanced process control methodologies for controlling oxide formation using pressure. The present invention, in one or more implementations, includes a pressure stabilization system to dynamically adjust scavenger pressure in a furnace during wafer fabrication in relation to a pressure formation range, value, or one or more pressure indicators in a wafer fabrication process.
    Type: Grant
    Filed: November 12, 2007
    Date of Patent: March 4, 2014
    Assignee: Micrel, Inc.
    Inventor: Miles Dudman
  • Patent number: 7983776
    Abstract: The present invention is one or more implementations is a method of fabricating a semiconductor for improved oxide thickness control, defining a process tool, determining and evaluating performance variables, determining a performance impact factor and thereafter modifying control of the process tool in the fabrication process to operate in direct relation to the determined results of the present invention. The present invention sets forth definitive advantages in reducing engineering time, improving process controls and improving cycle-times.
    Type: Grant
    Filed: November 8, 2007
    Date of Patent: July 19, 2011
    Assignee: Micrel, Inc.
    Inventors: Miles Dudman, Andrew Le
  • Publication number: 20100007363
    Abstract: The present invention relates generally to semiconductor wafer fabrication and more particularly but not exclusively to advanced process control methodologies for measuring in-line contact resistance in relation to oxide formations. The present invention, in one or more implementations, include an in-line method of determining contact resistance across a semiconductor wafer and determining the contact resistance value and the number of monolayers of the wafer.
    Type: Application
    Filed: December 3, 2007
    Publication date: January 14, 2010
    Applicant: Micrel, Inc.
    Inventors: Miles DUDMAN, Andrew LE, Daniel ANDERSON
  • Publication number: 20090176181
    Abstract: The present invention relates generally to semiconductor wafer fabrication and more particularly but not exclusively to advanced process control methodologies for controlling oxide formation using pressure. The present invention, in one or more implementations, includes a pressure stabilization system to dynamically adjust scavenger pressure in a furnace during wafer fabrication in relation to a pressure formation range, value, or one or more pressure indicators in a wafer fabrication process.
    Type: Application
    Filed: November 12, 2007
    Publication date: July 9, 2009
    Applicant: MICREL, INC.
    Inventor: Miles DUDMAN
  • Publication number: 20090125140
    Abstract: The present invention is one or more implementations is a method of fabricating a semiconductor for improved oxide thickness control, defining a process tool, determining and evaluating performance variables, determining a performance impact factor and thereafter modifying control of the process tool in the fabrication process to operate in direct relation to the determined results of the present invention. The present invention sets forth definitive advantages in reducing engineering time, improving process controls and improving cycle-times.
    Type: Application
    Filed: November 8, 2007
    Publication date: May 14, 2009
    Applicant: Micrel, Inc.
    Inventors: Miles Dudman, Andrew Le