Abstract: The invention relates to an optical sub-assembly package for use in receiver optical sub-assemblies or transmitter optical sub-assemblies in which the electrical connections between the transducer chip, e.g. photo-detector or light source, and the device printed circuit board is made by a single flexible circuit conductor extending through the wall of the package. The package is comprised of a housing and a stiffening plate, which encloses and end of the housing and forms a mechanical support for an end of the flexible circuit conductor.

Abstract: A flex cable is slit between conductor traces to provide conformable strips, at least one of which can be flipped to expose one of the conductor traces to the other side of the cable. This increases the design flexibility of the flex cable because the conductor traces can be exposed on both sides of the cable without laser ablation or etch operations to remove the substrate. Also, because the flex cable is slit along its length, it is more able to conform to different connector locations, thereby obviating the need for designing a different flex cable to accommodate changes in mating hardware.

Abstract: An enhanced electrical arrangement for a computer includes a circuit board, and a module arranged essentially parallel to the circuit board. An array connector is positioned between the circuit board and the module. The array connector causes the circuit board to be in electrical communication with the module. A clamping arrangement is provided for urging the circuit board and the module toward each other, by exerting a constant force against the module to cause an electrical connection between the circuit board, array connector and the module. The clamping arrangement includes an alignment assembly that is mounted to the circuit board to help align the module, and a load assembly to provide the force on the module. The alignment assembly and the load assembly are removably engageable with one another. When the load assembly is engaged with the alignment assembly, the load assembly can apply the force on the module which urges the module toward the array connector and the circuit board.

Abstract: The invention provides a locking bail that when in the locked position prevents the removal of an optical link module from a host system and when in the unlocked position provides a handle that facilitates the removal of an optical link module. By providing a locking bail, the packing density of modules in a host may be increased. The bail provides a handle which is accessible from the front of the module when the module is unlocked. The locking bail typically engages inclined planes on latch arms that secure an optical link module to the host system.

Abstract: A technique for filling hollow, plated-through-hole vias in multi-layer printed circuit substrates with solder and then joining the solder filled via with a solder ball on a solder ball connectable electronic module is disclosed. The filling of the vias is accomplished by depositing solder paste on one end of the hollow via and reflowing the solder particles within the solder paste to at least partially fill the PTH via. The depositing of the solder paste and the reflowing operations may be repeated until such time as the via is substantially completely filled with solid solder. The importance of the prefilling of the vias with solder is that the reflowing operation of solder balls or solder paste when joining the multi-layer printed circuit board to the electronic module, will prevent undue wicking or pulling of molten solder from the electrical connection into the PTH via, thereby preventing the formation of solder starved or unreliable electrical connections.