Abstract: Systems and methods for top side cooling for a power amplifier module are disclosed. The power amplifier module may be part of a system in a package that may be considered inverted relative to a normal orientation. A power amplifier die (and other elements) may be mounted on a metallization layer. Wire bond connections may communicatively couple the “top” of the power amplifier die to the metallization layer. A plated heat sink (PHS) laminate may be positioned “beneath” the power amplifier die in the metallization layer. The metallization layer may communicatively couple to vias that extend “up” and “above” the power amplifier die to a connection pad. The entire package is then inverted such that the connection pads may couple to a printed circuit board in a downward direction, and the PHS is now facing upward so that it may be coupled to a heat sink.