Abstract: A photovoltaic apparatus includes a plurality of approximately spherical photoelectric conversion elements including a second semiconductor layer located outside a first semiconductor layer, for generating photoelectromotive force therebetween. The second semiconductor layer has an opening through which part of the first semiconductor layer is exposed. The apparatus also includes a support having first and second conductors and an insulator disposed between the conductors for electrically insulating the conductors from each other. The support has recesses adjacent to each other, the inside surfaces of which are constituted by the first conductor. The photoelectric conversion elements are disposed in respective recesses so that the elements are illuminated with light reflected by part of the first conductor that constitutes the recess.

Abstract: A solar panel overlay for mounting on an underlying roof deck comprises a substrate and at least one row of photovoltaic cells on the substrate. The photovoltaic cells define a solar collecting surface having an appearance mimicking that of the underlying roof deck. A solar panel overlay assembly comprising a plurality of interconnect solar panel overlays is also provided.

Abstract: A flexible solar module is provided sufficient rigidity for use in construction, and comparable rigidity to a glass based solar module, by incorporation of a metal backing to the module, preferably in the laminated module. The rigidity of the construction is enhanced by the inclusion of a corrugation, either in the metal backing, or in a structure that is affixed to the backing. The resulting structure is a modular unit that has connection points and does not need to be connected to other modules to operate. A connection point is provided by an integrated junction box that allows for a simpler installation and the use of standard building techniques for the installation on a roof or wall.

Abstract: A method of fabricating a photovoltaic solar cell is provided. A plurality of generally spherical semiconductor elements are provided. Each of the semiconductor elements has a core and an outer surface surface forming a p-n junction. An anti-reflection coating is deposited on the outer surface of each of the semiconductor elements and each of the semiconductor elements is bonded into a perforated aluminum foil array thereby providing ohmic contact to a first side of the p-n junction. The anti-reflection coating is removed from a portion of each of the semiconductor elements and then the core is exposed, thereby allowing ohmic contact to be made to a second side of the p-n junction.