Abstract: Multiple encapsulated LED arrays on a single printed circuit board of an LED engine, the LED engine including a plurality of LED arrays that are mounted on the printed circuit board in a spaced apart configuration, and are electrically isolated from each other, and a plurality of encapsulation layers, wherein each of the encapsulation layers is configured to encapsulate each of the LED arrays, and is further configured to protect the area proximal to the LED engine from arc or spark generated by the LED engine, wherein each of the encapsulation layers includes a plurality of blisters that are configured to encapsulate at least one LED of an LED array, and is further configured to transform the light emitted by the LEDs into a desired light beam pattern, and at least one planar portion configured to encapsulate electrical traces formed on the printed circuit board.