Abstract: Provided is a system, method, and computer program product for in-situ pasteurization of electronics cooling liquid of an electronic liquid cooling loop. A processor may activate a cooling liquid pasteurization system that allows for pasteurization of the electronics cooling liquid. The processor may detect a temperature of the electronics cooling liquid, where heat generated by computer electronics of a computer system is transferred to the electronics cooling liquid. The processor may determine that the temperature of the electronics cooling liquid is within a target range that neutralizes bacteria. The processor may maintain the temperature of the electronics cooling liquid for a target time using the heat generated by the computer electronics of the computer system, where the target time corresponds to a pasteurization time frame for neutralizing bacteria in the electronics cooling liquid. The processor may deactivate the cooling liquid pasteurization system when the target time has been reached.

Abstract: Component positioning feedback within an electronic assembly is provided. The feedback process includes obtaining component position data from a plurality of sensors of the electronic assembly. The component position data facilitates in situ evaluation of positioning of the component within the electronic assembly. Further, the process includes determining, by data analysis of the component position data, a current positioning of the component of the electronic assembly relative to another component of the electronic assembly, and generating a position feedback signal based on the determined current positioning of the component of the electronic assembly relative to the other component of the electronic assembly.

Abstract: Embodiments of the disclosure provide cooling systems and cooling methods for isolating temperature fluctuation in an electronics enclosure. Embodiments of the disclosure provide effective cooling of high power temperature fluctuating components and a stable reference temperature for temperature sensitive components included in a single electronics enclosure. A disclosed multiple path cooling system includes a first path for cooling power variable components and a second path to maintain stable temperature cooling for temperature sensitive components.

Abstract: Embodiments of the present disclosure provide a mesh cooling structure, methods and battery cooling systems for cooling a battery cell, such as used in computer systems. The disclosed mesh cooling structure, method and battery cooling system provide effective battery cell cooling with the cooling mesh structure installed with a given battery cell to improve capacity and performance of the battery cell. The disclosed cooling mesh structure can be provided with selected battery cells in a battery pack to provide optimal battery capacity for the battery pack.

Abstract: Embodiments of the present disclosure provide systems and methods for configuring battery packs, such as used in computer systems. The disclosed systems and methods provide an optimal battery configuration of battery cell types in the battery pack, improving battery performance and a functional operational period for the battery pack. The disclosed systems and methods select an optimal battery type for each position of the battery cells in a linear battery cell string of the battery pack.

Abstract: An apparatus that includes a plurality of linkage arms connected one to another by one of a plurality of joints, wherein the plurality of linkage arms has a first end and a second end, and the first end is adapted to allow for removable attachment of a cold plate from a cooling assembly in a computer server, and a coupling that reversibly connects the second end of the plurality of linkage arms to a location on the cooling assembly, wherein the coupling is adapted to allow the plurality of linkage arms to be held in place at the location on the cooling assembly. The plurality of linkage arms are adapted to move along a predefined travel pathway and adapted to be reversibly converted between at least a lowered configuration and a service configuration.

Abstract: Apparatuses and methods of fabrication are provided which include a mechanical coolant pump to facilitate pumping a coolant through a coolant loop. The mechanical coolant pump is to couple to an individual and be physically powered by a specified movement of the individual to pump coolant. Coolant pumped by the mechanical coolant pump is circulated by the coolant pump through a device associated with the individual to cool the device.

Abstract: A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surface; and a cold plate connected in thermal communication with the second major surface.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: A computer equipment cooling device comprising: a temperature dependent thermal conduction member that includes a first major surface and a second major surface; a set of fins connected in thermal communication with the first major surface; and a cold plate connected in thermal communication with the second major surface.

Abstract: Embodiments include a cooling device for a medical device. The cooling device including a controller configured to receive data from one or more temperature sensors and a pump, configured to be operated by the controller, to circulate a cooling fluid through a cooling system and through fluid channels in the medical device. The cooling device is configured to be worn by a user and to be selectively coupled to the medical device by the user.

Abstract: Apparatuses and methods of fabrication are provided which include a mechanical coolant pump to facilitate pumping a coolant through a coolant loop. The mechanical coolant pump is to couple to an individual and be physically powered by a specified movement of the individual to pump coolant. Coolant pumped by the mechanical coolant pump is circulated by the coolant pump through a device associated with the individual to cool the device.

Abstract: A system, an article of manufacture, and a method are disclosed. The system includes a set of components in an enclosure. The set of components includes electronic devices and airflow moving components configured to maintain airflow across the electronic devices from a front plenum of the enclosure to a rear plenum of the enclosure and direct air from the rear plenum through the first heat exchanger. The set of components also includes a first heat exchanger configured to circulate a cooling liquid and a second heat exchanger configured to maintain a constant temperature of the cooling liquid, wherein the constant temperature is a temperature of the cooling liquid within a threshold distance from a selected temperature.

Abstract: Embodiments include a cooling device for a medical device. The cooling device including a controller configured to receive data from one or more temperature sensors and a pump, configured to be operated by the controller, to circulate a cooling fluid through a cooling system and through fluid channels in the medical device. The cooling device is configured to be worn by a user and to be selectively coupled to the medical device by the user.

Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.

Abstract: Apparatuses and methods are provided for blocking removal of an air-moving assembly from a housing when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the housing, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

Abstract: Apparatuses and methods are provided for protectively covering an air inlet or outlet of an air-moving assembly. The apparatus includes a protective cover assembly, which includes a retractable cover and a spring-biasing mechanism. The retractable cover transitions between a retracted state, when the air-moving assembly is operatively positioned within the chassis, and in extended state, when the air-moving assembly is withdrawn from the chassis. In retracted state, the retractable cover is retracted away from the air inlet or outlet, and in extended state, the retractable cover covers, at least partially, the air inlet or outlet. The spring-biasing mechanism is coupled to the retractable cover and biases the retractable cover in the extended state when the air-moving assembly is withdrawn from the chassis, and compresses to allow transition of the retractable cover to the retracted state as the air-moving assembly is inserted into operative position within the chassis.

Abstract: Automated managing of a data center installation is provided. The managing includes evaluating, at least in part by image processing analysis, a captured image of at least a portion of the data center installation to identify a component-related deficiency within the data center installation. One or more measurements within a data center are used to determine an energy penalty due to the identified component-related deficiency within the data center installation, and an action to correct the component-related deficiency within the data center installation is initiated based on the energy penalty exceeding a predefined threshold.

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.