Abstract: A fixture for making laminated integrated circuit devices from layers of integrated circuits comprises a base having support structure for at least two side body portions. The side body portions are adapted to be held in position by the support structure and project outwardly from the base in an orientation for substantially enclosing a plurality of the integrated circuit layers in a desired alignment for subsequent lamination to one another. The support structure enables the side body portions to be spaced from one another and have only one degree of freedom of movement toward and away from one another, enough to accommodate some dimensional differences between the plurality of integrated circuit layers. A retainer holds the side body portions in a fixed relative position providing the desired alignment for the subsequent lamination. The retainer biases the side body portions toward one another.

Abstract: A fixture for making laminated integrated circuit devices from layers of integrated circuits includes a base and at least two side body portions for substantially enclosing the sides of the laminating integrated circuit layers. The side body portions have inside surfaces for engaging the layers of integrated circuits so as to hold the layers in a desired alignment during curing. Structure is provided for retaining the side body portions in position so as to hold the layers in the desired alignment.