Patents by Inventor Milo{hacek over (s)} Hovorka

Milo{hacek over (s)} Hovorka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11380529
    Abstract: Methods and systems for generating high resolution reconstructions of 3D samples imaged using slice and view processes where the electron interaction depth of the imaging beam is greater than slice thicknesses. Data obtained via such slice and view processes is enhanced with a depth blur reducing algorithm, that is configured to reduce depth blur caused by portions of the first data and second data that are resultant from electron interactions outside the first layer and second layer, respectively, to create enhanced first data and second enhanced data. A high-resolution 3D reconstruction of the sample is then generated using the enhanced first data and the enhanced second data. In some embodiments, the depth blur reducing algorithm may be selected from a set of such algorithms that have been individually configured for certain microscope conditions, sample conditions, or a combination thereof.
    Type: Grant
    Filed: September 30, 2020
    Date of Patent: July 5, 2022
    Assignee: FEI Company
    Inventors: Pavel Potocek, Milo{hacek over (s)} Hovorka, Maurice Peemen, Luká{hacek over (s)} Hübner
  • Patent number: 11282670
    Abstract: Methods and systems include acquiring instances of data relating to multiple layers of a sample obtained via slice and view imaging where the electron interaction depth of the charged particle beam during each irradiation of the sample is larger than the thickness of the first layer and/or the thickness of the second layer. A simulated model is then accessed that identifies a plurality of yield values that identify expected portions/ratios of detected emissions that are expected to be generated by material in corresponding layers/depths of the sample. The yield values are used to segregate the instances of data into component portions based on the particular layer of the sample in which the structures expected to have generated the associated emissions are located. The component portions are then used to create reconstructions of individual layers and/or 3D reconstructions of the sample with reduced depth blur.
    Type: Grant
    Filed: December 29, 2020
    Date of Patent: March 22, 2022
    Assignee: FEI Company
    Inventors: Pavel Potocek, Luká{hacek over (s)} Hübner, Milo{hacek over (s)} Hovorka, Erik Rene Kieft