Patents by Inventor Milton Lee Buschbom

Milton Lee Buschbom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6800944
    Abstract: A substrate (110) for an unpackaged integrated circuit (IC) chip (118). The substrate comprises an insulative material (112), a plurality of contacts (114) disposed thereon, and a conductive ring (150) disposed around the outer perimeter of the contacts (114). Conductive traces (115) may be disposed around one or more contacts (114) and may be coupled to the conductive ring (150). An electro-less plating technique is utilized to plate contacts (114), avoiding unnecessary conductive material such as plating stubs being included in the contact (114) pattern, reducing interference. The conductive ring (150) shields the chip (118) from interference.
    Type: Grant
    Filed: December 19, 2001
    Date of Patent: October 5, 2004
    Assignee: Texas Instruments Incorporated
    Inventor: Milton Lee Buschbom
  • Publication number: 20030111738
    Abstract: A substrate (110) for an unpackaged integrated circuit (IC) chip (118). The substrate comprises an insulative material (112), a plurality of contacts (114) disposed thereon, and a conductive ring (150) disposed around the outer perimeter of the contacts (114). Conductive traces (115) may be disposed around one or more contacts (114) and may be coupled to the conductive ring (150). An electro-less plating technique is utilized to plate contacts (114), avoiding unnecessary conductive material such as plating stubs being included in the contact (114) pattern, reducing interference. The conductive ring (150) shields the chip (118) from interference.
    Type: Application
    Filed: December 19, 2001
    Publication date: June 19, 2003
    Inventor: Milton Lee Buschbom