Patents by Inventor Min-A YOON

Min-A YOON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10381312
    Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package according to embodiments of the present disclosure includes a wiring including a plurality of layers including an insulating layer and a wiring layer, a semiconductor chip mounted on the wiring and electrically connected to the wiring layer through a bonding pad, a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer, and an encapsulant configured to seal the cover member. Accordingly, the cover member covers the semiconductor chip and is in contact with the wiring formed under the semiconductor chip, thereby reducing electromagnetic interference, minimizing noise between operations of the semiconductor package, and improving a signal speed.
    Type: Grant
    Filed: May 11, 2017
    Date of Patent: August 13, 2019
    Assignee: NEPES CO., LTD.
    Inventors: Il-Hwan Kim, Jun-Kyu Lee, Min-A Yoon, Dong-Hoon Oh, Tae-Won Kim
  • Publication number: 20170330839
    Abstract: Disclosed herein are a semiconductor package and a method of manufacturing the same. The semiconductor package according to embodiments of the present disclosure includes a wiring including a plurality of layers including an insulating layer and a wiring layer, a semiconductor chip mounted on the wiring and electrically connected to the wiring layer through a bonding pad, a cover member configured to cover side surfaces of the semiconductor chip and the wiring and be in contact with at least one wiring layer, and an encapsulant configured to seal the cover member.
    Type: Application
    Filed: May 11, 2017
    Publication date: November 16, 2017
    Inventors: Il-Hwan KIM, Jun-Kyu LEE, Min-A YOON, Dong-Hoon OH, Tae-Won KIM