Patents by Inventor Min-A Yu
Min-A Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 12173194Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability.Type: GrantFiled: July 25, 2019Date of Patent: December 24, 2024Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Patent number: 12173195Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range.Type: GrantFiled: July 25, 2019Date of Patent: December 24, 2024Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Patent number: 12157839Abstract: The present application relates to an epoxy-based adhesive composition, which may include (a) one or more epoxy resins, (b) a urethane resin having a weight average molecular weight (Mw) of 30,000 or less, and having a polytetrahydrofuran unit, (c) a core-shell rubber in the form of secondary particles in which two or more core-shell rubbers in the form of primary particles are aggregated and (d) one or more epoxy curing agents. The adhesive composition of the present application can provide excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: GrantFiled: July 25, 2019Date of Patent: December 3, 2024Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Patent number: 12116506Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: GrantFiled: July 25, 2019Date of Patent: October 15, 2024Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Patent number: 12098306Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: GrantFiled: July 25, 2019Date of Patent: September 24, 2024Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210284882Abstract: The present application relates to an epoxy-based adhesive composition, which may include (a) one or more epoxy resins, (b) a urethane resin having a weight average molecular weight (Mw) of 30,000 or less, and having a polytetrahydrofuran unit, (c) a core-shell rubber in the form of secondary particles in which two or more core-shell rubbers in the form of primary particles are aggregated and (d) one or more epoxy curing agents. The adhesive composition of the present application can provide excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 16, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210284884Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 16, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210284885Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesion strength, peel strength and impact-resistant strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 16, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210269689Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range.Type: ApplicationFiled: July 25, 2019Publication date: September 2, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Publication number: 20210238462Abstract: An epoxy-based adhesive composition and methods for manufacturing the same are provided. The adhesive composition provides excellent adhesive strength and impact strength uniformly over a wide temperature range. In addition, the adhesive composition of the present application may have a level of viscosity capable of ensuring excellent processability.Type: ApplicationFiled: July 25, 2019Publication date: August 5, 2021Applicant: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Min A Yu, Min Kyoun Kim, Byung Kyu Cho, Taek Yong Lee, Dong Yong Kim
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Patent number: 9302466Abstract: Provided are an ink composition usable in a solar battery manufacturing process, a method of forming a pattern using the ink composition, an insulation film formed of the ink composition, and an etching mask formed of the ink composition. The ink composition includes: a) a polymerizable compound having an ethylenically unsaturated bond; b) a fluorinated surfactant; and c) a solvent, wherein the ink composition has a solid content of 45 parts by weight to 99.99 parts by weight.Type: GrantFiled: May 3, 2013Date of Patent: April 5, 2016Assignee: LG CHEM, LTD.Inventors: Min-A Yu, Yong-Sung Goo, Joon-Hyung Kim
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Patent number: 9249302Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.Type: GrantFiled: August 11, 2014Date of Patent: February 2, 2016Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Kyung Mi Kim, Young Ju Park, Jae Ho Jung, Min A Yu, Min Kyoun Kim
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Patent number: 9056984Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.Type: GrantFiled: August 11, 2014Date of Patent: June 16, 2015Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Dae Ho Kang, Min A Yu, Min Kyoun Kim, Byung Kyu Cho
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Patent number: 8946350Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.Type: GrantFiled: July 29, 2013Date of Patent: February 3, 2015Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Min A Yu
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Patent number: 8937131Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.Type: GrantFiled: July 29, 2013Date of Patent: January 20, 2015Assignee: LG Chem, Ltd.Inventors: Min Jin Ko, Jae Ho Jung, Bum Gyu Choi, Min A Yu
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Publication number: 20140346550Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability, and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance at a high temperature, gas barrierability, and crack resistance, and thus, when applied to a semiconductor device, may stably maintain performance of the device at a high temperature for a long time.Type: ApplicationFiled: August 11, 2014Publication date: November 27, 2014Inventors: Min Jin KO, Kyung Mi KIM, Young Ju PARK, Jae Ho JUNG, Min A YU, Min Kyoun KIM
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Publication number: 20140350194Abstract: Provided are a curable composition and its use. The curable composition may provide a cured product having excellent processability, workability and adhesive property, and having no whitening and surface stickiness. The curable composition has excellent thermal resistance and crack resistance at high temperature, and excellent gas barrier ability, and thus allows a semiconductor device to stably maintain performance at high temperature for a long time when applied to the device.Type: ApplicationFiled: August 11, 2014Publication date: November 27, 2014Inventors: Min Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Dae Ho KANG, Min A. YU, Min Kyoun KIM, Byung Kyu CHO
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Publication number: 20140199527Abstract: Provided are an ink composition usable in a solar battery manufacturing process, a method of forming a pattern using the ink composition, an insulation film formed of the ink composition, and an etching mask formed of the ink composition. The ink composition includes: a) a polymerizable compound having an ethylenically unsaturated bond; b) a fluorinated surfactant; and c) a solvent, wherein the ink composition has a solid content of 45 parts by weight to 99.99 parts by weight.Type: ApplicationFiled: May 3, 2013Publication date: July 17, 2014Applicant: LG CHEM, LTD.Inventors: Min-A Yu, Yong-Sung Goo, Joon-Hyung Kim
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Publication number: 20140039113Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processibility and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.Type: ApplicationFiled: July 29, 2013Publication date: February 6, 2014Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Jae Ho Jung, Bum Gyu Choi, Min A. Yu
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Publication number: 20140039112Abstract: Provided are a curable composition and its use. The curable composition can exhibit excellent processability and workability. The curable composition exhibits excellent light extraction efficiency, hardness, thermal and shock resistance, moisture resistance, gas permeability and adhesiveness, after curing. In addition, the curable composition can provide a cured product that exhibits long-lasting durability and reliability even under harsh conditions, and that does not cause whitening and surface stickiness.Type: ApplicationFiled: July 29, 2013Publication date: February 6, 2014Applicant: LG CHEM, LTD.Inventors: Min Jin KO, Jae Ho JUNG, Bum Gyu CHOI, Min A YU