Abstract: A display device includes a first region, a second region adjacent to a side of the first region, and a third region adjacent to another side of the first region; a display panel in the first region, the second region and the third region; a window on and overlapping the display panel; and a bonding member between the display panel and the window and in the first region, the second region and the third region. The bonding member includes a first bonding part having a first elastic modulus and in the first region, a second bonding part having a second elastic modulus and in the second region, and a third bonding part having a third elastic modulus and in the third region. The first elastic modulus is greater than each of the second elastic modulus and the third elastic modulus.

Abstract: Disclosed are novel compounds of Chemical Formula 1, optical isomers of the compounds, and pharmaceutically acceptable salts of the compounds or the optical isomers. The compounds, isomers, and salts exhibit excellent activity as GLP-1 receptor agonists. In particular, they, as GLP-1 receptor agonists, exhibit excellent glucose tolerance, thus having a great potential to be used as therapeutic agents for metabolic diseases. Moreover, they exhibit excellent pharmacological safety for cardiovascular systems.

Abstract: An apparatus for repairing elements, includes: a bonding material transfer stamp transferring a new bonding material to a repair area on a substrate, the repair area having a defective element or a residual bonding material removed therefrom; and an element transfer stamp transferring a new element to the new bonding material, wherein the element transfer stamp comprises a load control portion for elements, the load control portion being bent and deformed upon receiving pressing force such that a zero-stiffness load smaller than a critical damage load of the new element is applied to the new element.

Abstract: An embodiment of the present invention provides a transfer film that may be used for both a picking process and a placing process of an element, a transfer method using the transfer film, and an electronic product manufactured using the same. Here, the transfer film according to an embodiment of the present invention includes a base part, an adhesion part, and a first protrusion part. The adhesion part is provided on one surface of the base part, and at least part of the first protrusion part is formed and protruded on one surface of the base part to be accommodated inside the adhesion part, and the thickness increases toward the first direction parallel to the surface of the base part.

Abstract: The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. The load control layer has a first zero-rigidity area that maintains a first stress in a first deformation range from a first strain to a second strain.

Abstract: The present invention relates to a carrier film for transferring a microelement, wherein, when a microelement is pressurized, a uniform pressurizing force is provided to the entire microelement, and a damage to the microelement can be prevented. The carrier film for transferring a microelement comprises: a load control layer having a first elastic modulus and having a space formed in a part of the interior thereof; and an adhesive layer having a second elastic modulus that is smaller than the first elastic modulus, the adhesive layer being provided on the upper portion of the load control layer and configured such that a microelement supposed to be transferred to a target substrate is attached thereto. The load control layer has a first zero-rigidity area that maintains a first stress in a first deformation range from a first strain to a second strain.