Abstract: Provided is a method for manufacturing a membrane-electrode assembly. The method includes forming an electrode layer, preparing a porous support layer, and positioning the electrode layer on each of both surfaces of the porous support layer and hot-pressing the electrode layer positioned on the both surfaces. The forming of the electrode layer incudes forming a functional layer including a hydrogen ion conductive binder resin on at least a portion of an electrode catalyst layer, and forming an electrolyte layer on at least a portion of the functional layer. The preparing of the porous support layer includes performing a pretreatment process by impregnating the porous support layer with a pretreatment composition, and the performing of the pretreatment process includes dipping the porous support layer in a first pretreatment composition and then drying the porous support layer, and dipping the porous support layer after drying in a second pretreatment composition.

Abstract: The present disclosure provides a semiconductor structure, including an Nth metal layer, a bottom electrode over the Nth metal layer, a magnetic tunneling junction (MTJ) over the bottom electrode, a top electrode over the MTJ, and an (N+M)th metal layer over the Nth metal layer. N and M are positive integers. The (N+M)th metal layer surrounds a portion of a sidewall of the top electrode. A manufacturing method of forming the semiconductor structure is also provided.

Abstract: The present disclosure provides semiconductor devices and methods of forming the same. A semiconductor device of the present disclosure includes a first source/drain feature and a second source/drain feature over a substrate, a plurality of channel members extending between the first source/drain feature and the second source/drain feature, a gate structure wrapping around each of the plurality of channel members, and at least one blocking feature. At least one of the plurality of channel members is isolated from the first source/drain feature and the second source/drain feature by the at least one blocking feature.

Abstract: An excimer bulb assembly, with an excimer bulb, at least one integral captured reflector, and an integral filter such that the excimer bulb only emits substantial UV radiation between 200 nm and 230 nm, using a filter that passes light from about 200 nm to 234 nm (+/?2 nm).

Abstract: A processor-implemented decoding method in a first neural network is provided. The method predicts probabilities of candidates of an output token based on at least one previously input token, determines the output token among the candidates based on the predicted probabilities; and determines a next input token by selecting one of the output token and a pre-defined special token based on a determined probability of the output token.

Abstract: A chip package structure includes a substrate, at least two chips, a plurality of first pads, a plurality of first micro bumps, and a bridging element. The substrate has a first surface and a second surface opposite to the first surface. The two chips are disposed on the first surface of the substrate and are horizontally adjacent to each other. Each chip has an active surface. The first pads are disposed on the active surface of each of the chips. The first micro bumps are disposed on the first pads and have the same size. The bridging element is disposed on the first micro bumps such that one of the chips is electrically connected to another of the chips through the first pads, the first micro bumps, and the bridging element.

Abstract: The present specification relates to an organic light emitting diode.

Abstract: Provided are a substrate processing method and a device manufactured by using the same, which may improve etch selectivity of an insulating layer deposited on a stepped structure. The substrate processing method includes: forming a first layer on a stepped structure having an upper surface, a lower surface, and a side surface connecting the upper surface and the lower surface; weakening at least a portion of the first layer; forming a second layer on the first layer; and performing an isotropic etching process on the first layer and the second layer.

Abstract: A secondary battery according to the present invention comprises an electrode assembly in which an electrode and a separator are alternately stacked and a battery case accommodating the electrode assembly therein, wherein the battery case comprises a stepped part that is disposed to be stepped, an outer surface of the battery case is sealed to allow a folded part to be seated on the outer surface of the stepped part, and the electrode assembly comprises a stepped protrusion that is stepped in a shape corresponding to an inner surface of the stepped part disposed on the battery case.

Abstract: A system and method of identifying and tracking objects comprises registering an identity of a person who visits an area designated for holding objects, capturing an image of the area designated for holding objects, submitting a version of the image to a deep neural network trained to detect and recognize objects in images like those objects held in the designated area, detecting an object in the version of the image, associating the registered identity of the person with the detected object, retraining the deep neural network using the version of the image if the deep neural network is unable to recognize the detected object, and tracking a location of the detected object while the detected object is in the area designated for holding objects.

Abstract: A display panel including sub pixels, a plurality of first and second scan lines, a plurality of first and second data lines, a plurality of first and second auxiliary lines and first conductive vias is provided. The sub pixels are arranged into first rows arranged in a first direction and second rows arranged in a second direction. The second rows are electrically connected to the first and second scan lines in alternation and are electrically connected to the first and second data lines in alternation. Each first auxiliary line includes a first portion electrically connected to a corresponding first scan line and a second portion spaced away from the first portion. The second auxiliary lines are respectively located between two adjacent first rows. Each second scan line is electrically connected to a corresponding first scan line through at least one second auxiliary line.

Abstract: A motor driving circuit and a motor driving method are provided. The motor driving circuit is used to drive the motor and includes an inverter circuit, a control circuit, a current-limiting circuit, a start circuit and a transient circuit. The control circuit controls the inverter circuit to drive the motor with a motor control current according to a set current limit value indicated by a current-limiting signal, and outputs a steady state ready signal in response to the motor reaching a steady state. The current-limiting circuit generates the current-limiting signal according to a start state signal, or generates the current-limiting signal according to a transient signal. The start circuit outputs the start state signal when the motor starts. The transient circuit detects whether the motor is in a transient state, and outputs the transient signal in response to the motor being in a transient state.

Abstract: One embodiment of a camera module includes: a lens barrel provided with at least one lens; and a lens holder having the lens barrel coupled thereto, wherein the lens barrel may have a first adhesive part formed thereon having the bottom surface thereof facing the top surface of the lens holder and adhered to the lens holder, the lens holder may have a second adhesive part formed thereon having the top surface thereof facing the bottom surface of the lens barrel and adhered to the lens barrel, and a first recessed groove having at least a portion of an adhesive deposited therein may be formed in the second adhesive part.

Abstract: Disclosed is a die-bonding method which provides a target substrate having a circuit structure with multiple electrical contacts and multiple semiconductor elements each semiconductor element having a pair of electrodes, arranges the multiple semiconductor elements on the target substrate with the pair of electrodes of each semiconductor element aligned with two corresponding electrical contacts of the target substrate, and applies at least one energy beam to join and electrically connect the at least one pair of electrodes of every at least one of the multiple semiconductor elements and the corresponding electrical contacts aligned therewith in a heating cycle by heat carried by the at least one energy beam in the heating cycle. The die-bonding method delivers scattering heated dots over the target substrate to avoid warpage of PCB and ensures high bonding strength between the semiconductor elements and the circuit structure of the target substrate.

Abstract: The present disclosure provides a technical solution related to establishing a characterized chatbot with personality. On one hand, a corpus database matched with a specific character may be established, and a generated regular/conventional response messages may be converted into a characterized response messages with character's features during conversation, so that the conversation style of a chatbot may be characterized with a certain character's features. On the other hand, a chatbot may select a response message with a specific emotion by using an emotion conversation table corresponding to a personality when generating the response message against a content of a conversation input by a user, so that a chatbot may be characterized and have certain personality.

Abstract: According to various embodiments of the present invention, disclosed is an electronic device comprising: a housing that comprises a front surface, a back surface opposite the front surface, and side surfaces surrounding a space between the front surface and the back surface and made of a metal material; at least one antenna array disposed within the housing so as to radiate a millimeter wave signal toward the inside of the electronic device; a wireless communication circuit electrically connected to the at least one antenna array and configured to communicate by using the millimeter wave signal; and a reflecting member arranged such that the millimeter wave signal radiated from the at least one antenna array is reflected toward the outside of the electronic device. In addition, various embodiments known from the specification are possible.

Abstract: A micro device includes an epitaxial structure, an insulating layer, and a light-transmissive layer. The epitaxial structure has a top surface and a bottom surface opposite to each other and a peripheral surface connected to the top surface and the bottom surface. The insulating layer covers the peripheral surface and the bottom surface of the epitaxial structure and exposes a portion of the peripheral surface. The light-transmissive layer covers the top surface of the epitaxial structure and is extended over at least a portion of the portion of the peripheral surface.

Abstract: The present disclosure discloses a piezoelectric self-powered combination beam vibration damper and a control method thereof. An upper guiding component is installed inside an upper rigid frame, a lower guiding component is installed inside a lower rigid component, a guide rod is nested inside the upper guiding component and the lower guiding component, an upper elastic component is sleeved outside the upper idler wheel mechanism, a lower elastic component is sleeved outside the lower idler wheel mechanism, one end of each piezoelectric cantilever beam is fixed between the upper rigid frame and the lower rigid frame, the other end of each piezoelectric cantilever beam is arranged between the upper idler wheel mechanism and the lower idler wheel mechanism, at least one piezoelectric cantilever beam is connected with the input end of a circuit system, and other piezoelectric cantilever beams are connected with the output end of the circuit system.