Abstract: A resin including a unit represented by Chemical Formula 1, a method for preparing the same, a resin composition including the same, and a molded article including the resin composition is described: wherein all the variables are described herein.

Abstract: Disclosed is a marine organism antifouling apparatus for ships using a UV-C module. The marine organism antifouling apparatus includes circular or polygonal net units and at least one UV-C module configured to be turned on to emit ultraviolet light by power supplied thereto, the UV-C module being provided at each of the net units, wherein the net units are connected to each other in horizontal and vertical directions to constitute a net member, and ultraviolet light is emitted from the UV-C module to prevent attachment of marine organisms in the state in which an underwater exposure zone of a ship that is moored is surrounded by the net member.

Abstract: Provided is an aerogel blanket and a method for producing the same, wherein a catalyzed sol is sufficiently and uniformly impregnated into a blanket in an impregnation tank, and the catalyzed sol is allowed to stay in the impregnation tank for a specific time to control fluidity while achieving a viscosity at which the catalyzed sol can be easily introduced into the blanket, thereby forming a uniform aerogel in the blanket. As a result, the uniformity of pore structure and thermal insulation performance of an aerogel blanket are improved, the loss of raw materials is reduced through the impregnation process, the occurrence of process problems is reduced, and the generation of dust is reduced.

Abstract: A semiconductor device comprising: a lower insulating layer; a field insulating layer on the lower insulating layer; an upper insulating layer on the field insulating layer; a first through via in the upper insulating layer; a second through via in the field insulating layer; and a third through via in the lower insulating layer, wherein the second through via is connected to the first and third through vias, and wherein a width of a top surface of the second through via is greater than a width of a bottom surface of the first through via, a width of a bottom surface of the second through via is greater than a width of a top surface of the third through via, and a width of a middle portion of the second through via is greater than the widths of the top surface and the bottom surface of the second through via.

Abstract: A semiconductor device a first fin-shaped pattern provided at a first surface of a substrate and extending in a second direction, a first source/drain pattern disposed on the first fin-shaped pattern and connected thereto, a first source/drain contact disposed on the first source/drain pattern and connected thereto, a buried conductive pattern extending through the substrate and connected to the first source/drain contact, a contact connection via disposed between the first source/drain contact and the buried conductive pattern. The contact connection via is directly connected to the first source/drain contact and a back wiring line disposed on a second surface of the substrate and connected to the buried conductive pattern. A width of the contact connection via increases as the contact connection via extends away from the second surface. A width of the first source/drain contact decreases as the first source/drain contact extends away from the second surface of the substrate.

Abstract: A semiconductor device include a substrate including a plurality of protrusions protruding from an upper surface thereof and arranged two-dimensionally in a first direction and a second direction intersecting each other, a first trench provided between the protrusions in the first direction, and a second trench provided between the protrusions in the second direction, a first device isolation layer filling the first trench, gate patterns disposed on the protrusions in the second direction, upper surfaces of the protrusions exposed at both sides of the gate patterns, respectively, and a second device isolation layer filling a space between the gate patterns in the second direction and the second trench, and each of the gate patterns has a first sidewall adjacent to the second trench and aligned with an inner wall of the second trench.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.

Abstract: A method of manufacturing a multilayer electronic component includes cutting a stack, in which internal electrode patterns and ceramic green sheets are alternately stacked in a stacking direction, to obtain unit chips and attaching a portion of a ceramic green sheet for a side margin portion to the unit chips in a direction, different from the stacking direction. The attaching includes attaching the portion of the ceramic green sheet to the unit chips by compression between a first elastic body on which the ceramic green sheet is disposed and the unit chips. The first elastic body includes a first elastic layer having and a second elastic layer having an elastic modulus different from the first elastic layer, and disposed between the unit chips and the first elastic layer. An elastic modulus of the first elastic body is greater than 50 MPa and less than or equal to 1000 MPa.

Abstract: A display device includes a display portion including a first surface, from which light is emitted in a first direction, and a second surface opposite to the first surface, a first optical portion disposed on the first surface, and a second optical portion disposed on the first surface to be spaced apart from the first optical portion in a second direction crossing the first direction. Each of the first and second optical portions includes a multi-channel lens through which the light from the first surface passes, a first infrared light source, a first camera, and a first lens frame coupled to the multi-channel lens in the first direction to support at least a portion of the multi-channel lens. The first lens frame may include a first recess structure in which the first infrared light source is disposed and a second recess structure in which the first camera is disposed.

Abstract: Provided is a bonding wire for a semiconductor package, which includes an insulating layer formed on the outer surface of a core portion by a thin layer deposition method, so that the occurrence of a short-circuit during wire bonding is fundamentally prevented and bondability is improved. The bonding wire for a semiconductor package comprises: a core portion formed of a conductive metal; and an insulating layer formed on the outer surface of the core portion by a thin layer deposition method.

Abstract: Discussed is a bolting device that effectively protects an internal configuration of a battery pack and increases manufacturing efficiency during a bolting operation. The bolting device for manufacturing a battery pack includes an electric screwdriver provided with a rotation motor; a driver bit connected to the rotation motor to enable a rotation movement and configured to rotate a bolt; a bit guide member provided with a hollow tube such that the driver bit is inserted into an inside of the hollow tube to be movable; and a guide jig provided with a main body configured to be mounted on an upper portion of a pack housing, the main body having a plate shape and having at least one through hole, and a fixing member inserted into the through hole and mounted therein, and having an insertion hole.

Abstract: Provided is an aerogel blanket and a method for producing the same, wherein a catalyzed sol I sufficiently and uniformly impregnated into a blanket in an impregnation tank, and the catalyzed sol is allowed to stay in the impregnation tank for a specific time to control fluidity while achieving a viscosity at which the catalyzed sol can be easily introduced into the blanket, thereby forming a uniform aerogel in the blanket. As a result, the uniformity of pore structure and thermal insulation performance of an aerogel blanket are improved, the loss of raw materials is reduced through the impregnation process, the occurrence of process problems is reduced, and the generation of dust is reduced.

Abstract: Provided is a keyword management method of an electronic apparatus. The keyword management method may include confirming a landing page type corresponding to a keyword associated with a search service of another apparatus, checking whether the keyword corresponds to a keyword set, changing the landing page type corresponding to the keyword when the keyword corresponds to the keyword set and the confirmed landing page type is not a landing page type related to the keyword set, and providing information on the changed landing page type to the other apparatus.

Abstract: A semiconductor device is disclosed. The semiconductor device includes a transceiver including an amplifier region configured to output a data signal to a source line connected to a pixel during a first period and receive a detection signal from a touch electrode during a second period different from the first period, and configured to generate the data signal based on input data; and a driving controller configured to generate the data based on input image data, outputting the data to the transceiver, and generate a touch signal based on the detection signal.

Abstract: A display device is provided. A display device includes a non-display area where no image is displayed, and a display area where images are displayed, and including a first area and a second area having different light transmittances, and a first pixel and a second pixel, wherein a transistor and an anode electrode of the first pixel are in the first area, wherein an anode electrode of the second pixel is in the second area, and a transistor of the second pixel is outside the second area, wherein the anode electrode and the transistor of the second pixel are electrically connected by a connection line, and wherein at least a part of the connection line is in at least one of the first area and the second area, and is covered by an anti-reflection layer.

Abstract: A system for delivering items or packages to an unattended vehicle after receiving an order for delivery of an item or package to a vehicle is disclosed. The system determines identifying information for the vehicle, where the identifying information includes a wireless identifier of the vehicle. The system determines a delivery location of the vehicle. The system transmits a request to dispatch a delivery vehicle to deliver a package to the vehicle, wherein the request comprises the identifying information and the delivery location.

Abstract: The exemplary embodiments of the present disclosure provides a method and a system for blocking illegal withdrawal of a virtual asset by monitoring unapproved fraudulent transactions in which the virtual asset address managed by the virtual asset exchange connected to the virtual asset blockchain network is designated as the transfer address and restricting withdrawal transactions using a double payment prevention policy for unapproved illegal transactions.

Abstract: A method and an apparatus for virtual training based on tangible interaction are provided. The apparatus acquires data for virtual training, and acquires a three-dimensional position of a real object based on a depth image and color image of the real object and infrared (IR) data included in the obtained data. Then, virtualization of an overall appearance of a user is performed by extracting a depth from depth information on a user image included in the obtained data and matching the extracted depth with the color information, and depth data and color data for the user obtained according to virtualization of the user is visualized in virtual training content. In addition, the apparatus performs correction on joint information using the joint information and the depth information included in the obtained data, estimates a posture of the user using the corrected joint information, and estimates a posture of a training tool using the depth information and IR data included in the obtained data.

Abstract: An organic light emitting diode display including: a substrate; a TFT on the substrate; a planarization layer on the TFT; a pixel electrode on the planarization layer, wherein the pixel electrode includes upper and lower layers including a transparent conductive oxide and an intermediate layer including silver; an etch stop layer on the pixel electrode, wherein an upper surface of the pixel electrode is exposed by the etch stop layer; a partition on the etch stop layer, wherein the upper surface of the pixel electrode is exposed by the partition; an organic emission layer on the upper surface of the pixel electrode where the upper surface of the pixel electrode is exposed by the etch stop layer and the partition; and a common electrode on the organic emission layer and the partition, wherein the etch stop layer covers an edge and a side surface of the pixel electrode.

Abstract: A semiconductor device including a first interlayer insulating film; a conductive pattern in the first interlayer insulating film; a resistance pattern on the conductive pattern; an upper etching stopper film spaced apart from the resistance pattern, extending in parallel with a top surface of the resistance pattern, and including a first metal; a lower etching stopper film on the conductive pattern, extending in parallel with a top surface of the first interlayer insulating film, and including a second metal; and a second interlayer insulating film on the upper etching stopper film and the lower etching stopper film, wherein a distance from a top surface of the second interlayer insulating film to a top surface of the upper etching stopper film is smaller than a distance from the top surface of the second interlayer insulating film to a top surface of the lower etching stopper film.