Abstract: A fluid feeder includes a fluid storage unit and a pre-treatment unit. The fluid storage unit provides a fluid flow path through which a fluid mixture of a hydrophilic fluid and a hydrophobic fluid flows. The fluid storage unit is connected through a plurality of connectors to the fluid flow path having a portion, in which an ultrasound focusing unit for focusing ultrasound to disperse and mix the fluids contained in the fluid mixture by focused ultrasound is mounted, to flow the fluid mixture in the fluid flow path and to flow the fluid mixture dispersed by the ultrasound focusing unit through the fluid flow path. In the pre-treatment unit, the fluid mixture is dispersed at micrometer scale and supplied to the fluid storage unit before the fluid mixture is stored in the fluid storage unit.

Abstract: Disclosed is a method for preparing a stable fluid mixture by mixing hydrophilic and hydrophobic substances using ultrasound wherein homogeneous dispersion and mixing are possible so that dispersibility is greatly improved and separation between the hydrophilic and hydrophobic substances is minimized even after a long time.

Abstract: A method for surface modification of oxide ceramics including the alumina ceramics used as heat resistant parts, wear resistant parts, the semiconductor fabricating parts, etc., and oxide ceramics produced by the method, in which the surface modification is carried out by permeating a glass into the surface of the oxide ceramics through heat treatment, so that the flexural strength, the heat resistance, and the wear resistance may be improved and the surface cracks may be cured. The surface modification method for oxide ceramics includes the step for carrying out heat treatment for the oxide ceramics and the glass at 1000-1700° C. for several seconds to several hours by using a heating element such as an electric heating furnace. According to the surface modification method for the oxide ceramics, the strength, the heat resistance, and the wear resistance of the oxide ceramics may be improved by simple procedure at a low cost.

Abstract: A wafer support and peripheral parts thereof are used in a heating apparatus for semiconductor wafers and are made of a silicon nitride-silicon carbide ceramic composite containing 5 to 30 weight % silicon carbide. The wafer support and peripheral parts have superior crack healing characteristic in addition to superior thermal resistance, thermal shock resistance, and chemical stability.