Patents by Inventor Min Cheol Kim

Min Cheol Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12221160
    Abstract: An embodiment vehicle body side structure includes a front pillar located behind a front wheel, the front pillar comprising a chamfer surface that is diagonally inclined from a lower portion of the front pillar towards an interior of a vehicle, the chamfer surface being aligned with the front wheel in a longitudinal direction of the vehicle, and a side sill connected to the lower portion of the front pillar.
    Type: Grant
    Filed: September 1, 2022
    Date of Patent: February 11, 2025
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Keon Woo Kim, Min Cheol Kim
  • Publication number: 20240426905
    Abstract: A test device for a semiconductor package and provides a test device for a semiconductor package for enlarging a pick and place area of a lower package to an entire size of the lower package using a floating plate movably coupled to a pusher and having a silicon pad disposed between the pusher and the floating plate to be moveable by elasticity of the silicon pad.
    Type: Application
    Filed: June 10, 2024
    Publication date: December 26, 2024
    Applicant: TSE CO., LTD
    Inventors: Min Cheol KIM, Sol LEE, Hyeon Gyeong YANG
  • Patent number: 12169219
    Abstract: An apparatus for testing a semiconductor package, in which a second test circuit board, which is disposed on an upper socket assembly to form a vacuum line in the related art, is removed, and a vacuum guide including two components disposed between an upper socket and an upper package. The vacuum guide including a conductive guide member made of an inelastic insulating material disposed on a conductive region part to prevent an electrical short circuit, and a peripheral guide member made of a metallic material having rigidity and disposed on a peripheral region portion to prevent deformation of a vacuum line, such that a length of a signal path is significantly decreased, high-speed signal transmission is possible. The stable vacuum line is ensured in the upper socket assembly, and vacuum pressure from a vacuum generation device is smoothly applied to a vacuum picker.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: December 17, 2024
    Assignee: TSE CO., LTD.
    Inventors: Min Cheol Kim, Sol Lee
  • Publication number: 20240376565
    Abstract: The present disclosure provides a method for removing chlorine from a process solution in zinc hydrometallurgy, the method comprising: a step for preparing the process solution from a leaching process of leaching a zinc calcine; a step for introducing the process solution to a reactor and introducing a lead concentrate into the reactor while blowing-in oxygen; a step for solid-liquid separating of a slurry in a filtration tank, the slurry being produced in the reactor; and a step for post-processing a filtrate and a lead concentrate residue separated in the step for solid-liquid separating, wherein chlorine ions in the process solution and silver contained in the lead concentrate react with each other in the reactor to precipitate a silver chloride.
    Type: Application
    Filed: April 25, 2023
    Publication date: November 14, 2024
    Inventors: Min Cheol KIM, Heon Sik CHOI
  • Publication number: 20240366623
    Abstract: The present invention relates to a pharmaceutical composition for preventing or treating Charcot-Marie-Tooth disease associated with a peripheral nervous system, comprising a compound represented by formula I, optical isomers thereof or pharmaceutically acceptable salts thereof as an active ingredient, a method for preventing or treating Charcot-Marie-Tooth disease associated with the peripheral nervous system using the compound, a use of the compound for preventing or treating Charcot-Marie-Tooth disease associated with the peripheral nervous system, and a use of the compound in preparing a medicament for preventing or treating Charcot-Marie-Tooth disease associated with the peripheral nervous system.
    Type: Application
    Filed: August 30, 2022
    Publication date: November 7, 2024
    Inventors: Nina Ha, Daekwon Bae, Min Cheol Kim, Ju Young Song, Dong-hyeon Suh, Suk Jin Lee, Jiyeon Baek, Jin Sol Park
  • Patent number: 12085602
    Abstract: The test circuit monitoring positive bias temperature instability (PBTI) includes a PBTI monitoring unit driven according to a power voltage, the PBTI monitoring unit outputting an output voltage having a potential that is equal to or lower than a potential of the power voltage according to a PBTI degradation rate of an NMOS transistor; and a degradation determiner for determining the PBTI degradation rate by comparing the potential of the output voltage to the potential of the power voltage.
    Type: Grant
    Filed: December 12, 2022
    Date of Patent: September 10, 2024
    Assignee: SK hynix Inc.
    Inventors: Min Cheol Kim, Mi Ran Kim, Chang Hwi Lee
  • Patent number: 12045960
    Abstract: There are disclosed an apparatus and method for processing images.
    Type: Grant
    Filed: March 15, 2022
    Date of Patent: July 23, 2024
    Assignee: AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Myung Hoon Sunwoo, Min Cheol Kim
  • Publication number: 20240200211
    Abstract: An embodiment of the present invention provides an electrocatalyst composite including a 2D transition metal chalcogenide material for water electrolysis and a method for manufacturing the same. According to one embodiment of the present invention, the electrocatalyst composite for water electrolysis is manufactured by hetero-junctioning 2D nickel cobalt sulfide (NiCo2S4) and 2D rhenium sulfide (ReS2) to allow for high activity and application over a broad pH range during water electrolysis.
    Type: Application
    Filed: December 14, 2023
    Publication date: June 20, 2024
    Applicant: RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY
    Inventors: Jung Kyu KIM, Min Cheol KIM, Won SO, Jae Kyum KIM, Ho Seok PARK
  • Patent number: 11994554
    Abstract: The present disclosure relates to a test apparatus for a package-on-package type semiconductor package including a lower test socket mounted on a tester, and connected to a lower package to electrically connect the lower package to the tester; a pusher configured to be able to be moved vertically by receiving a driving force from a driving unit; an upper test socket mounted on the pusher, and having an electro-conductive part installed below the upper package to be electrically connected to the upper package; a vacuum picker mounted on the upper test socket to be able to vacuum-adsorb the lower package; and an inelastic insulating sheet installed between the upper test socket and the upper package, having a through hole formed at a position thereof corresponding to the terminal of the upper package and the electro-conductive part.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: May 28, 2024
    Assignee: TSE CO., LTD.
    Inventors: Sol Lee, Min Cheol Kim
  • Publication number: 20240172416
    Abstract: A semiconductor device includes a substrate having a substrate groove extending in a first direction, a gate insulating layer conformally covering an inner wall of the substrate groove, a metal-containing pattern on the gate insulating layer and filling a lower portion of the substrate groove, a silicon pattern on the metal-containing pattern in the substrate groove, and a word line capping pattern on the silicon pattern in the substrate groove, wherein the silicon pattern includes a first silicon pattern covering an upper surface of the metal-containing pattern and a sidewall of the gate insulating layer and having a pattern groove formed thereon and a second silicon pattern filling the pattern groove, the first silicon pattern having a first impurity concentration, and the second silicon pattern having a second impurity concentration less than the first impurity concentration.
    Type: Application
    Filed: August 31, 2023
    Publication date: May 23, 2024
    Inventors: Jonghyeok KIM, Kang In KIM, Kyuwan KIM, Min-Cheol KIM, Youngseok KIM, Taewoong OH
  • Publication number: 20240151769
    Abstract: A test apparatus for testing image sensor packages. The test apparatus is configured to stably vacuum-absorb an image sensor package in a surface manner, wherein when a vacuum adsorption sheet having a package adsorption hole in the shape of a wide square surface is coupled to the bottom of the floating plate at which an upper socket is seated, a vacuum line is formed by connecting the cover vacuum hole of the pusher, the board vacuum hole of the upper circuit board, the plate vacuum hole of the floating plate, and the package adsorption hole of the vacuum adsorption sheet together.
    Type: Application
    Filed: October 23, 2023
    Publication date: May 9, 2024
    Applicant: TSE CO., LTD
    Inventors: Min Cheol KIM, Sol LEE
  • Patent number: 11940484
    Abstract: An apparatus for testing a package-on-package type semiconductor package includes an upper test socket on which an upper package is mounted, the upper test socket being mounted on a pusher and connected to the lower package; a lower test socket mounted on a tester and connected to the lower package; and an adsorption pad coupled to the pusher and configured to adsorb and pressurize the lower package using a vacuum pressure, wherein the adsorption pad comprises a body part having a vacuum pressure passage formed therein; and an adsorption part having an adsorption hole corresponding to the vacuum pressure passage, and the body part is attached on a central portion of an upper surface of the adsorption part and an outer oil overflow-preventing part configured to trap silicon oil eluted from the body part is formed at an outer periphery the adsorption part.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: March 26, 2024
    Assignee: TSE CO., LTD.
    Inventors: Sol Lee, Min Cheol Kim
  • Patent number: 11938115
    Abstract: The present disclosure relates to a benzoselenophene-based compound, a method of preparing the benzoselenophene-based compound, and a pharmaceutical composition and antibody-drug conjugate including the benzoselenophene-based compound.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: March 26, 2024
    Assignee: AIMED BIO INC.
    Inventors: Dongyeol Lim, Min Cheol Kim, Amol Mhetre, Do-Hyun Nam
  • Publication number: 20240094013
    Abstract: Provided are a method and device for providing an in-vehicle interface. The method may provide a first interface before driving of a vehicle, a second interface after the driving of the vehicle starts, and a third interface after completion of the driving of the vehicle.
    Type: Application
    Filed: April 27, 2023
    Publication date: March 21, 2024
    Inventors: Hyun Seok KIM, Min Cheol Kim, Se Il Jeong
  • Publication number: 20240003961
    Abstract: The test circuit monitoring positive bias temperature instability (PBTI) includes a PBTI monitoring unit driven according to a power voltage, the PBTI monitoring unit outputting an output voltage having a potential that is equal to or lower than a potential of the power voltage according to a PBTI degradation rate of an NMOS transistor; and a degradation determiner for determining the PBTI degradation rate by comparing the potential of the output voltage to the potential of the power voltage.
    Type: Application
    Filed: December 12, 2022
    Publication date: January 4, 2024
    Applicant: SK hynix Inc.
    Inventors: Min Cheol KIM, Mi Ran KIM, Chang Hwi LEE
  • Publication number: 20230400308
    Abstract: The present disclosure relates to a method for searching for the shortest path having a minimum link between buildings in a rectilinear polygon obstacle environment, which has been implemented to calculate the shortest path having a minimum link, among the shortest paths based on a Manhattan distance from one building to another building, when buildings are given in a rectilinear polygon obstacle environment. According to the present disclosure, in searching for the shortest path having a minimum link between two buildings, a more efficient data structure can be used in terms of an execution time and memory. A building-building minimum link and shortest path search problem can be solved through only the addition of very small operations by using the segment-point minimum link and shortest path search algorithm which can be easily expanded to the building-building minimum link and shortest path search problem.
    Type: Application
    Filed: May 16, 2023
    Publication date: December 14, 2023
    Applicant: POSTECH ACADEMY-INDUSTRY FOUNDATION
    Inventors: Hee Kap AHN, Tae Kang EOM, Hwi KIM, Min Cheol KIM
  • Publication number: 20230384368
    Abstract: In an apparatus for testing a package-on-package (POP) type semiconductor package according to the present disclosure, a vacuum picker has vacuum holes that communicate with an insulation pad hole, the vacuum picker includes a body part made of silicone or rubber, and a socket contact part and a package contact part made of any one of polyimide film, engineering plastic, and synthetic resin, and the socket contact part is attached to a mounting groove by means of an adhesive tape, such that the vacuum picker is coupled to an upper socket.
    Type: Application
    Filed: January 11, 2023
    Publication date: November 30, 2023
    Applicant: TSE CO., LTD.
    Inventors: Min Cheol KIM, Sol LEE
  • Publication number: 20230384364
    Abstract: An apparatus for testing a semiconductor package, in which a second test circuit board, which is disposed on an upper socket assembly to form a vacuum line in the related art, is removed, and a vacuum guide including two components disposed between an upper socket and an upper package. The vacuum guide including a conductive guide member made of an inelastic insulating material disposed on a conductive region part to prevent an electrical short circuit, and a peripheral guide member made of a metallic material having rigidity and disposed on a peripheral region portion to prevent deformation of a vacuum line, such that a length of a signal path is significantly decreased, high-speed signal transmission is possible. The stable vacuum line is ensured in the upper socket assembly, and vacuum pressure from a vacuum generation device is smoothly applied to a vacuum picker.
    Type: Application
    Filed: January 12, 2023
    Publication date: November 30, 2023
    Applicant: TSE CO., LTD.
    Inventors: Min Cheol KIM, Sol LEE
  • Publication number: 20230347908
    Abstract: Provided are a method and device for providing an interface for managing a vehicle operating corporation and an interface for managing an affiliated driver belonging to a vehicle operating corporation.
    Type: Application
    Filed: April 27, 2023
    Publication date: November 2, 2023
    Inventors: Hyun Seok KIM, Min Cheol KIM, SE IL JEONG
  • Publication number: 20230303182
    Abstract: An embodiment vehicle body side structure includes a front pillar located behind a front wheel, the front pillar comprising a chamfer surface that is diagonally inclined from a lower portion of the front pillar towards an interior of a vehicle, the chamfer surface being aligned with the front wheel in a longitudinal direction of the vehicle, and a side sill connected to the lower portion of the front pillar.
    Type: Application
    Filed: September 1, 2022
    Publication date: September 28, 2023
    Inventors: Keon Woo Kim, Min Cheol Kim