Patents by Inventor Min Cheol Park

Min Cheol Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250212326
    Abstract: A printed circuit board includes a magnetic structure including a magnetic layer having a through-hole, an insulating film disposed on a wall surface of the through-hole, the insulating film including an inorganic insulating material, and a conductor layer disposed on the insulating film, the conductor layer filling at least a portion of the through-hole, the conductor layer including a metal, an insulating layer covering at least a portion of the magnetic structure, a wiring layer disposed on or in the insulating layer, and a via layer disposed in the insulating layer, the via layer including a first connection via connecting the conductor layer to the wiring layer.
    Type: Application
    Filed: November 22, 2024
    Publication date: June 26, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong LEE, Hee Soo YOON, Min Cheol PARK, Jung Ho SHIM, Hyun Sang KWAK
  • Publication number: 20250114881
    Abstract: The present invention relates to a jig assembly for an electrode tab, which includes: a first pressing member and a second pressing member, which are configured to press plurality of electrode tabs; and an adjustment jig configured to space the first pressing member and the second pressing member apart from each other to maintain an interval between the first pressing member and the second pressing member to adjust a pressing force applied to the electrode tabs.
    Type: Application
    Filed: February 9, 2023
    Publication date: April 10, 2025
    Applicant: LG Energy Solution, Ltd.
    Inventors: Min Cheol Park, Jin Yong Lee
  • Patent number: 12211649
    Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.
    Type: Grant
    Filed: June 28, 2022
    Date of Patent: January 28, 2025
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Cheol Park, Sang Jong Lee, Hyung Joon Kim, Hyun Sang Kwak, Chi Hyeon Jeong, Seong Hwan Lee
  • Publication number: 20250007752
    Abstract: The present disclosure relates to an edge platform management device. an operation method of edge platform management device, and an edge gateway device which may efficiently support multi-tenancy within an edge platform required in a mobile-edge computing (MEC) environment.
    Type: Application
    Filed: July 4, 2022
    Publication date: January 2, 2025
    Inventor: Min Cheol PARK
  • Publication number: 20250007449
    Abstract: A solar power generator for forming a uniform focal region is proposed. The proposed relates to a solar power generator for forming a uniform focal region and, more particularly, to a solar power generator for forming a uniform focal region and, the solar power generator being capable of forming the uniform focal region in a specific area with an infinite number of focuses by reflected sunlight, controlling the focal region by adjusting an angle and width according to position changes of the focal region due to optical path distortion, and controlling generated power according to purpose of use.
    Type: Application
    Filed: November 16, 2021
    Publication date: January 2, 2025
    Inventors: Yong Jea JU, Hyun Il CHO, Byeong Do KANG, Min Cheol PARK, Chung Hee LEE, Raju TIMALSINA, Jin A CHOE
  • Publication number: 20240332199
    Abstract: A printed circuit board includes a substrate having an upper surface at which a plurality of first pads are disposed, and an interconnect structure including an encapsulant, a plurality of second pads disposed at an upper surface of the encapsulant, and a plurality of metal wires disposed in the encapsulant and respectively connected to at least one of the plurality of second pads, the interconnect structure disposed on an upper side of the substrate. At least a portion of an upper surface of each of the plurality of first and second pads is exposed in an upward direction from the upper surface of each of the substrate and the encapsulant.
    Type: Application
    Filed: July 27, 2023
    Publication date: October 3, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Hyeon JEONG, Seong Hwan LEE, Hyun Sang KWAK, Min Cheol PARK, Sang Jong LEE
  • Patent number: 11978595
    Abstract: A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: May 7, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Su Bong Jang, Min Cheol Park, Tae Ho Yun, Han Kim
  • Publication number: 20240146646
    Abstract: The present disclosure relates to an edge platform management device, an operating method of edge platform management device, and an edge gateway device which suggest an efficient connection method between a Layer 2 (L2)-based switch and a Layer-3 (L3)-based traffic-processing gateway node in a mobile-edge computing (MEC) environment.
    Type: Application
    Filed: July 4, 2022
    Publication date: May 2, 2024
    Inventor: Min Cheol PARK
  • Publication number: 20240062960
    Abstract: According to an embodiment of the present disclosure, since the outer electrode of the first unit device and the outer electrode of the second unit device may have different polarities, capacitance may be generated in each of the first unit device and the second unit device and capacitance may be generated between the first and second unit devices, thereby maximizing capacitance per unit volume.
    Type: Application
    Filed: July 13, 2023
    Publication date: February 22, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Han Kim, Sang Jong Lee, Min Cheol Park, Su Bong Jang
  • Patent number: 11901125
    Abstract: A capacitor component includes a body including a capacitance formation portion including a plurality of unit devices including a first internal electrode, a first dielectric film surrounding the first internal electrode, and a second internal electrode surrounding the first dielectric film, and a molded portion surrounding the capacitance formation portion, first and second external electrodes respectively disposed on a first surface and a second surface of the body opposing each other in a first direction to be respectively connected to the first and second internal electrodes. Cross-sections perpendicular to the first direction of at least two of the plurality of unit devices have a polygonal shape.
    Type: Grant
    Filed: August 10, 2022
    Date of Patent: February 13, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong Lee, Han Kim, Min Cheol Park, Su Bong Jang
  • Patent number: 11882622
    Abstract: The present disclosure relates to an edge computing (multi-access edge computing, MEC) technology and, to an edge computing management device and an operating method of an edge computing management device, which provide a data roaming service by utilizing an edge computing cloud (MEC cloud) that exists in a communication provider network.
    Type: Grant
    Filed: August 9, 2021
    Date of Patent: January 23, 2024
    Assignee: SK Telecom Co., LTD.
    Inventor: Min Cheol Park
  • Patent number: 11856772
    Abstract: A nonvolatile memory device and method of fabricating same, the nonvolatile memory device including a substrate; a first semiconductor layer on the substrate; an etching stop film including a metal oxide on the first semiconductor layer; a mold structure including second semiconductor layers and insulating layers alternately stacked on the etching stop film; a channel hole penetrating through at least one of the mold structure, the etching stop film, the second semiconductor layer and the substrate; and a channel structure extending along a side wall of the channel hole, including an anti-oxidant film, a first blocking insulation film, a second blocking insulation film, a charge storage film, a tunnel insulating film and a channel semiconductor sequentially formed along the side wall of the channel hole. The first semiconductor layer contacts the first blocking insulation film, the second blocking insulation film, the charge storage film, and the tunnel insulating film.
    Type: Grant
    Filed: July 16, 2020
    Date of Patent: December 26, 2023
    Inventors: Seung Won Lee, Tae Hun Kim, Min Cheol Park, Hye Ri Shin, Jun Hee Lim, Si Yeon Cho
  • Publication number: 20230381886
    Abstract: An ultrasonic welding apparatus includes: a pressing force measuring anvil including a pressing force measuring sensor; a horn which is installed to vertically move above the pressing force measuring anvil and presses the pressing force measuring anvil when moving downward; a horn down stroke adjustment part that adjusts a down stroke of the horn so that a pressing force of the horn is within a preset pressing force range; and a welding anvil on which welding target members to be welded by the horn are and supportable by the welding anvil and of which a position is changed to a position of the pressing force measuring anvil so that the welding anvil is positioned under the horn after the down stroke of the horn is adjusted to be within the preset pressing force range.
    Type: Application
    Filed: July 18, 2022
    Publication date: November 30, 2023
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Jin Yong LEE, Hun Bum JUNG, Min Cheol PARK, Jong Baek KIM
  • Publication number: 20230343519
    Abstract: A capacitor component, includes: a body including first and second surfaces opposing each other in a first direction, wherein, in the body, a first internal electrode, a second internal electrode, a first dielectric layer interposed between the first and second internal electrodes, and a second dielectric layer disposed on the second internal electrode are wound in the first direction as a winding axis; a first external electrode disposed on the first surface and connected to the first internal electrode; and a second external electrode disposed on the second surface and connected to the second internal electrode. The first internal electrode and the second internal electrode include different metals.
    Type: Application
    Filed: July 28, 2022
    Publication date: October 26, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong LEE, Min Cheol PARK, Chi Hyeon JEONG, Seong Hwan LEE, Hyun Sang KWAK
  • Publication number: 20230343515
    Abstract: A capacitor component includes a body including a capacitance formation portion including a plurality of unit devices including a first internal electrode, a first dielectric film surrounding the first internal electrode, and a second internal electrode surrounding the first dielectric film, and a molded portion surrounding the capacitance formation portion, first and second external electrodes respectively disposed on a first surface and a second surface of the body opposing each other in a first direction to be respectively connected to the first and second internal electrodes. Cross-sections perpendicular to the first direction of at least two of the plurality of unit devices have a polygonal shape.
    Type: Application
    Filed: August 10, 2022
    Publication date: October 26, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong LEE, Han KIM, Min Cheol PARK, Su Bong JANG
  • Publication number: 20230307179
    Abstract: A multilayer capacitor includes: a body including a capacitance region in which at least one first internal electrode and at least one second internal electrode are alternately laminated in a first direction with at least one dielectric layer interposed therebetween; and first and second external electrodes spaced apart from each other and respectively disposed on first and second surfaces of the body, the first and second surfaces opposing each other. The body further includes a first via electrode, connecting the at least one first internal electrode and the first external electrode to each other in the first direction, and a second via electrode connecting the at least one second internal electrode and the second external electrode to each other in the first direction.
    Type: Application
    Filed: June 28, 2022
    Publication date: September 28, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Cheol PARK, Sang Jong LEE, Hyung Joon KIM, Hyun Sang KWAK, Chi Hyeon JEONG, Seong Hwan LEE
  • Publication number: 20230296641
    Abstract: An automatic immunoassay system is provided to an automatic immunoassay apparatus and includes a well cartridge provided with a plurality of wells in which a tip mounted on the automatic immunoassay apparatus is sequentially dipped, a cartridge loading mechanism coupled to a lower portion of the well cartridge to couple the well cartridge to the holding plate, a light source unit disposed at one side of the cartridge unit to emit light to the wells, a sensing unit disposed at the other side of the cartridge unit to detect a fluorescence signal generated by light delivered to the wells, and an assay unit analyzing the fluorescence signals detected by the sensing unit.
    Type: Application
    Filed: August 17, 2022
    Publication date: September 21, 2023
    Applicant: ABSOLOGY Co.,Ltd.
    Inventors: Min Cheol Park, Han Sang JO
  • Patent number: 11694848
    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: July 4, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Sang Soo Park, Min Cheol Park, Byoung Hwa Lee
  • Publication number: 20230197347
    Abstract: A capacitor component includes a body having first surface and second surfaces opposing each other and including through-holes penetrating through the first surface and the second surface, a first electrode covering an inner wall of each of the plurality of through-holes, a first common electrode covering the first surface and connected to the first electrode, a dielectric layer surrounded by the first electrode in the through-hole, a second electrode surrounded by the dielectric layer in the through-hole, a second common electrode layer covering the second surface and connected to the second electrode, a first external electrode disposed on at least one of a plurality of side surfaces of the body and connected to the first common electrode layer, and a second external electrode disposed on at least one of the plurality of side surfaces of the body and connected to the second common electrode layer.
    Type: Application
    Filed: April 4, 2022
    Publication date: June 22, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sang Jong LEE, Su Bong JANG, Min Cheol PARK, Tae Ho YUN, Han KIM
  • Publication number: 20220246356
    Abstract: There is provided a multilayered ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; an upper cover layer; a lower cover layer formed below the active layer, the lower cover layer being thicker than the upper cover layer; first and second external electrodes; at least one pair of first and second internal electrodes repeatedly formed inside the lower cover layer, wherein, when A is defined as ½ of an overall thickness of the ceramic body, B is defined as a thickness of the lower cover layer, C is defined as ½ of an overall thickness of the active layer, and D is defined as a thickness of the upper cover layer, a ratio of deviation between a center of the active layer and a center of the ceramic body, (B+C)/A, satisfies 1.063?(B+C)/A?1.745.
    Type: Application
    Filed: April 14, 2022
    Publication date: August 4, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu AHN, Sang Soo PARK, Min Cheol PARK, Byoung Hwa LEE