Patents by Inventor Min-Chin LIN

Min-Chin LIN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194848
    Abstract: The light emitting diode packaging structure includes a flexible substrate, micro light emitting elements disposed on the flexible substrate, a conductive pad, a redistribution layer, and an electrode pad. The micro light emitting elements have a first surface facing to the flexible substrate and a second surface opposite to the first surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting elements. The redistribution layer covers the micro light emitting elements and the conductive pad. The redistribution layer includes an insulating layer and a circuit layer embedded in the insulating layer. The circuit layer is electrically connected to the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer.
    Type: Application
    Filed: February 27, 2024
    Publication date: June 13, 2024
    Inventors: Chih-Hao LIN, Jo-Hsiang CHEN, Shih-Lun LAI, Min-Che TSAI, Jian-Chin LIANG
  • Patent number: 11949056
    Abstract: The light emitting diode packaging structure includes a flexible substrate, a first adhesive layer, micro light emitting elements, a conductive pad, a redistribution layer, and an electrode pad. The first adhesive layer is disposed on the flexible substrate. The micro light emitting elements are disposed on the first adhesive layer and have a first surface facing to the first adhesive layer and an opposing second surface. The micro light emitting elements include a red micro light emitting element, a blue micro light emitting element, and a green micro light emitting element. The conductive pad is disposed on the second surface of the micro light emitting element. The redistribution layer covers the micro light emitting elements and the conductive pad. The electrode pad is disposed on the redistribution layer and is electrically connected to the circuit layer. A thickness of the flexible substrate is less than 100 um.
    Type: Grant
    Filed: April 20, 2023
    Date of Patent: April 2, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Chih-Hao Lin, Jo-Hsiang Chen, Shih-Lun Lai, Min-Che Tsai, Jian-Chin Liang
  • Publication number: 20240102286
    Abstract: A coupling structure is arranged between a first boundary member and a second boundary member. The coupling structure mainly includes a main coupling unit, a reinforcement unit, and a concrete layer, and the reinforcement unit is arranged on the main coupling unit and surrounds an intermediate area of the main coupling unit, and the main coupling unit and the reinforcement unit are both embedded in the concrete layer. The coupling structure can solve the current design difficulties of short columns and short beams and has excellent seismic performance and higher construction efficiency.
    Type: Application
    Filed: March 13, 2023
    Publication date: March 28, 2024
    Inventors: Min-Lang LIN, Lap-Loi CHUNG, Min-Chin LIN