Patents by Inventor Min-chul Yoon

Min-chul Yoon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250010780
    Abstract: A console table apparatus for a vehicle includes a first link module configured to selectively slide along a table, which can be drawn out from a console for a vehicle and positioned in an in use state and can be switched to a stored state. The console table apparatus also includes a second link module configured to support the first link module in the in use state and to selectively release a locking state as the table is switched to the stored state. The second link module is stored inside the console together with the first link module in the stored state.
    Type: Application
    Filed: November 30, 2023
    Publication date: January 9, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, NIFCO KOREA INC., ECOPLASTIC CORPORATION
    Inventors: Young Beom Lee, Min Chul Yoon, Won Young Bae, Hyo Jin Shin, Won Sang Cho, Dong Jin Park, Ui Seong Choi
  • Patent number: 10373796
    Abstract: A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.
    Type: Grant
    Filed: March 29, 2016
    Date of Patent: August 6, 2019
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Souk Kim, Chung-sam Jun, Woo-seok Ko, Sang-kil Lee, Kwang-il Shin, Yu-sin Yang, Min-chul Yoon
  • Publication number: 20160293379
    Abstract: A method of inspecting a wafer may include: loading of a wafer onto a stage, the wafer having a plurality of dies thereon; positioning of the wafer such that a plurality of electron beam columns on the wafer respectively face a partial region of each of the plurality of dies on the wafer; scanning the respective partial regions of each of the plurality of dies by using the electron beam columns; and combining a plurality of partial images that are obtained by scanning the partial regions to provide a die image.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 6, 2016
    Inventors: Souk Kim, Chung-sam Jun, Woo-seok Ko, Sang-Kil Lee, Kwang-il Shin, Yu-sin Yang, Min-chul Yoon