Abstract: There is provide a method for manufacturing analytical semiconductor samples by using an apparatus for manufacturing analytical semiconductor samples, which minimizes a feedback time by manufacturing a viewing surface that is environment-friendly and has a large area. The method comprising mounting the analytical semiconductor samples to a holder; discharging deionized (DI) water to an upper surface of a polishing plate through a DI water nozzle; grinding the analytical semiconductor samples with the upper surface of the polishing plat; determining whether a desired viewing surface of the analytical semiconductor samples has been acquired after the grinding of the analytical semiconductor samples; and transferring the analytical semiconductor samples to analyze the viewing surface of the ground analytical semiconductor samples based on a determination that the desired viewing surface of the analytical semiconductor samples has been acquired.

Abstract: Provided is a 3-dimensional (3D) image acquisition apparatus and a method of driving the same. The 3D image acquisition apparatus includes a light source, an optical shutter, an image sensor, an image signal processor, and a controller. The light source is configured to project illumination light on an object. The optical shutter is configured to modulate the illumination light reflected from the object with a predetermined gain waveform. The image sensor is configured to generate a depth image by detecting the illumination light modulated by the optical shutter. The image signal processor is configured to calculate a distance from the 3D image acquisition apparatus to the object using the depth image generated by the image sensor. The controller is configured to control an operation of the light source and an operation of the optical shutter.

Abstract: Provided is a 3-dimensional (3D) image acquisition apparatus and a method of driving the same. The 3D image acquisition apparatus includes a light source, an optical shutter, an image sensor, an image signal processor, and a controller. The light source is configured to project illumination light on an object. The optical shutter is configured to modulate the illumination light reflected from the object with a predetermined gain waveform. The image sensor is configured to generate a depth image by detecting the illumination light modulated by the optical shutter. The image signal processor is configured to calculate a distance from the 3D image acquisition apparatus to the object using the depth image generated by the image sensor. The controller is configured to control an operation of the light source and an operation of the optical shutter.