Patents by Inventor Min-Feng Chung

Min-Feng Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105379
    Abstract: A magnetic component includes a core, a winding, a lead frame and a conductive material. The winding is disposed in the core. A winding end of the winding extends to an outer periphery of the core. The lead frame is disposed on the outer periphery of the core. At least one hole is formed on the lead frame and corresponds to the winding end. The conductive material is disposed in the at least one hole. The conductive material is in contact with the winding end.
    Type: Application
    Filed: July 27, 2023
    Publication date: March 28, 2024
    Applicant: CYNTEC CO., LTD.
    Inventors: Min-Feng Chung, Hao-Chun Chang, Tung-Cheng Chuang
  • Publication number: 20230411057
    Abstract: A coil structure comprises a coil and a conductive terminal part, wherein the coil is formed by a conductive wire comprising a metal wire and at least one insulating layer encapsulating the metal wire, wherein a first terminal part of the metal wire is exposed from the at least one insulating layer, wherein a first portion of the conductive terminal part encapsulates the first terminal part of the metal wire and a second portion of the conductive terminal part extends from said first portion as an electrode for electrically connecting to an external circuit.
    Type: Application
    Filed: September 4, 2023
    Publication date: December 21, 2023
    Inventors: Min-Feng Chung, Ching Hsiang Yu, Kuan Yu Chiu, YU-HSIN LIN
  • Patent number: 11798735
    Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.
    Type: Grant
    Filed: January 13, 2021
    Date of Patent: October 24, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Kuan Yu Chiu, Ching Hsiang Yu, Min-Feng Chung
  • Patent number: 11791079
    Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: October 17, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Min-Feng Chung, Ching Hsiang Yu, Kuan Yu Chiu, Yu-Hsin Lin
  • Patent number: 11551857
    Abstract: At least one shielding layer made of conductive material is formed on a body of a magnetic device to prevent magnetic fields from leaking to the outside of the magnetic device so as to reduce EMI and the size of the magnetic device.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: January 10, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Min-Feng Chung, Meihua Chen, Po-I Wu
  • Publication number: 20220384088
    Abstract: A coupled inductor has two pillars that are aligned in a vertical direction, wherein a first coil and a second coil are respectively wound around one of the two pillars, respectively, wherein the bottom surface of winding turns of the first coil and the bottom surface of winding turns of the second coil are separated by a gap, wherein a magnetic material is disposed in the gap and a straight line that is enclosed by each of the first coil and the second coil passes through the two pillars.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Inventors: Chi-Hsun Lee, Min-Feng Chung
  • Patent number: 11462351
    Abstract: A coupled inductor has two pillars that are aligned in a vertical direction, wherein a first coil and a second coil are respectively wound around one of the two pillars, respectively, wherein the bottom surface of winding turns of the first coil and the bottom surface of winding turns of the second coil are separated by a gap, wherein a magnetic material is disposed in the gap and a straight line that is enclosed by each of the first coil and the second coil passes through the two pillars.
    Type: Grant
    Filed: December 22, 2018
    Date of Patent: October 4, 2022
    Assignee: CYNTEC CO., LTD.
    Inventors: Chi-Hsun Lee, Min-Feng Chung
  • Publication number: 20220157512
    Abstract: A structure for forming a 3D-coil transponder, wherein each group of leads is encapsulated by a separated insulating molding body and a magnetic body disposed over the plurality of separated groups of leads, wherein each said insulating molding body does not extend across two or more groups of leads.
    Type: Application
    Filed: May 12, 2021
    Publication date: May 19, 2022
    Inventors: Min-Feng Chung, Kuan Yu Chiu, Ching Hsiang Yu
  • Publication number: 20220148793
    Abstract: A shielding layer that is made of conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor to shield the coil from the external magnetic field and make the resistance and the power loss of the inductor lower.
    Type: Application
    Filed: January 25, 2022
    Publication date: May 12, 2022
    Inventors: Shuen-Chang Hung, Min-Feng Chung
  • Publication number: 20220130603
    Abstract: At least one shielding layer made of conductive material is formed on a body of an inductor, wherein at least one portion of the top surface of the body is exposed from the shielding layer, so as to provide an exhaust channel for moisture inside the body to leak to the outside of the body, thereby preventing the residual moisture from deforming the inductor due to thermal expansion.
    Type: Application
    Filed: October 22, 2021
    Publication date: April 28, 2022
    Inventors: CHI-HSUN LEE, Min-Feng Chung
  • Publication number: 20220130599
    Abstract: A recess is formed on a bottom surface of a body of an inductor, wherein an electrode for connecting to a ground is disposed in the recess, and an electrode connecting with a coil of the inductor is disposed on a protruding portion adjacent to the recess.
    Type: Application
    Filed: October 22, 2021
    Publication date: April 28, 2022
    Inventors: CHI-HSUN LEE, Min-Feng Chung
  • Patent number: 11270834
    Abstract: A shielding layer that is made of a conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor so as to shield the coil from external magnetic field and make the resistance and the power loss of the inductor lower.
    Type: Grant
    Filed: January 11, 2019
    Date of Patent: March 8, 2022
    Assignee: CYNTEC CO., LTD.
    Inventors: Shuen-Chang Hung, Min-Feng Chung
  • Publication number: 20210217556
    Abstract: A structure of coils for a wireless charger comprises a plurality of coils, wherein the plurality of coils are stacked into a plurality of layers of coils with each layer comprising at least two coils, wherein at least two electronic devices are capable of being placed over the plurality of coils for charging the at least two electronic devices.
    Type: Application
    Filed: January 13, 2021
    Publication date: July 15, 2021
    Inventors: Kuan Yu Chiu, Ching Hsiang Yu, Min-Feng Chung
  • Publication number: 20200303107
    Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.
    Type: Application
    Filed: March 17, 2020
    Publication date: September 24, 2020
    Inventors: Min-Feng Chung, Ching Hsiang Yu, Kuan Yu Chiu, YU-HSIN LIN
  • Publication number: 20200303114
    Abstract: An inductor array comprising a magnetic body and a plurality of coils disposed in the magnetic body, wherein the magnetic body comprises a unitary portion that is disposed over and across the plurality of coils and extended into a space between each two adjacent coils of the plurality of coils.
    Type: Application
    Filed: March 17, 2020
    Publication date: September 24, 2020
    Inventors: TSUNG-CHAN WU, PEI-I WEI, Min-Feng Chung
  • Publication number: 20190318868
    Abstract: At least one shielding layer made of conductive material is formed on a body of a magnetic device to prevent magnetic fields from leaking to the outside of the magnetic device so as to reduce EMI and the size of the magnetic device.
    Type: Application
    Filed: April 12, 2019
    Publication date: October 17, 2019
    Inventors: Min-Feng Chung, Meihua Chen, Po-I Wu
  • Publication number: 20190221359
    Abstract: A shielding layer that is made of a conductive and magnetic material is used to encapsulate the bare metal wire of a coil of an inductor so as to shield the coil from external magnetic field and make the resistance and the power loss of the inductor lower.
    Type: Application
    Filed: January 11, 2019
    Publication date: July 18, 2019
    Inventors: Shuen-Chang Hung, Min-Feng Chung
  • Publication number: 20190198229
    Abstract: A coupled inductor has two pillars that are aligned in a vertical direction, wherein a first coil and a second coil are respectively wound around one of the two pillars, respectively, wherein the bottom surface of winding turns of the first coil and the bottom surface of winding turns of the second coil are separated by a gap, wherein a magnetic material is disposed in the gap and a straight line that is enclosed by each of the first coil and the second coil passes through the two pillars.
    Type: Application
    Filed: December 22, 2018
    Publication date: June 27, 2019
    Inventors: Chi-Hsun Lee, Min-Feng Chung