Patents by Inventor Min-Fu Lee

Min-Fu Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Carrier ring used in a deposition chamber
    Patent number: 11795544
    Abstract: A chamber for processing deposition on a wafer includes a wafer holder having a central surface region for placing a wafer and a carrier ring support surface encircling the central surface region; and a carrier ring disposed on the carrier ring support surface. The carrier ring comprises an annular disk body comprising an annular wafer support region, an annular peripheral region, and an annular transition region between the annular wafer support region and the annular peripheral region. The annular peripheral region comprises a top carrier ring surface. The annular wafer support region has a lower carrier ring surface that is in physical contact with a wafer during processing. The annular transition region comprises a curved slope between the top carrier ring surface and the lower carrier ring surface.
    Type: Grant
    Filed: November 2, 2021
    Date of Patent: October 24, 2023
    Assignee: United Semiconductor (Xiamen) Co., Ltd.
    Inventor: Min-Fu Lee
  • CARRIER RING USED IN A DEPOSITION CHAMBER
    Publication number: 20220056582
    Abstract: A chamber for processing deposition on a wafer includes a wafer holder having a central surface region for placing a wafer and a carrier ring support surface encircling the central surface region; and a carrier ring disposed on the carrier ring support surface. The carrier ring comprises an annular disk body comprising an annular wafer support region, an annular peripheral region, and an annular transition region between the annular wafer support region and the annular peripheral region. The annular peripheral region comprises a top carrier ring surface. The annular wafer support region has a lower carrier ring surface that is in physical contact with a wafer during processing. The annular transition region comprises a curved slope between the top carrier ring surface and the lower carrier ring surface.
    Type: Application
    Filed: November 2, 2021
    Publication date: February 24, 2022
    Applicant: United Semiconductor (Xiamen) Co., Ltd.
    Inventor: Min-Fu Lee
  • CARRIER RING USED IN A DEPOSITION CHAMBER
    Publication number: 20210123135
    Abstract: A carrier ring used in a deposition chamber includes an annular disk body comprising an annular wafer support region, an annular peripheral region, and an annular transition region between the annular wafer support region and the annular peripheral region. The annular peripheral region has a top carrier ring surface. The annular wafer support region has a lower carrier ring surface that is in physical contact with a wafer during processing. The annular transition region has a slope between the top carrier ring surface and the lower carrier ring surface. The slope downwardly inclines from the top carrier ring surface toward the wafer.
    Type: Application
    Filed: November 10, 2019
    Publication date: April 29, 2021
    Inventor: Min-Fu Lee